ATS-NVA2-3554-C3-R0 57.5 x 40.0 x 23.0 mm &BGA Heat Sink - High Performance&Device Specific

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*Image above is for illustration purpose only..

ATS Part#: ATS-NVA2-3554-C3-R0
Description:57.5 x 40.0 x 23.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
Component Specific:NVIDIA Jetson Orin™ NX (Super Mode)
Heat Sink Type:Active heat sink (fan not included)
Heat Sink Attachment:Leaf spring with screws
Installation Guide:N/A
Thermal Performance:See detail
Mechanical Drawing:See detail

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Part Number	Manufacturer	L (mm)	W (mm)	H (mm)	Voltage (VDC)	Air Flow (CFM)	Static Pressure (Pa)	Lead Wire
AFB0412SHB-F00	Delta	40	40	15	12	14.8 (0.42 m³/min)	149.7	3
9GA0412P7G001	Sanyo Denki	40	40	15	12	12.7 (0.36 m³/min)	192	4
PSD1204PHB1-A	Sunon	40	40	15	12	14.0 (0.40 m³/min)	156.9	2

Part Number	Lifecycle Status	Length (mm)	Width (mm)	Height (mm)	MOUNTING HOLE PATTERN CENTER TO CENTER (MM)	MOUNTING HOLE DIAMETER (MM)	Weight (gr)	TIM	FINISH
ATS-NVA2-3554-C3-R0	ACTIVE	57.5	40.0	23.0	43.2 X 28.8	1.6	56.0	Chomerics T766	Black Anodized

Schematic Image.	AIR VELOCITY		THERMAL RESISTANCE
Schematic Image.	FT/MIN	M/S	°C/W Unducted Flow	°C/W Ducted Flow
Image above is for illustration purpose only. A: Length \| B:Width \| C: Height \| D&E: Mounting Hole Pattern \| F: Mounting Hole Diameter*
	200	1.0	0.9	N/A
	400	2.0	N/A	N/A
	600	3.0	N/A	N/A
	800	4.0	N/A	N/A

Fan not included. Fan type is specific to individual customer requirements and needs to be independently sourced.
Dimensions A and B refer to heat sink size.
Dimension C is the heat sink height from the bottom of the base to the top of the fin field.
Dimensions D and E refer to the mounting hole pattern C-C (center to center)
Thermal performance data are provided for reference only. Actual performance may vary by application.
ATS reserves the right to update or change its products without notice to improve the design or performance
ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
Contact ATS to learn about custom options available.

ATS-NVA2-3554-C3-R0 (Data Sheet) 57.5 x 40.0 x 23.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
ATS-NVA2-3554-C3-R0 Mechanical Drawing - FUSED MODEL (used for Form and Fit use)
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