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ATS-NVP-3275-C3-R0 100.0 x 87.0 x 16.0  mm   BGA Heat Sink - High Performance Device Specific - NVIDIA
*Image above is for illustration purpose only..
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
ATS Part#: ATS-NVP-3275-C3-R0
Description: 100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Component Specific: NVIDIA® Jetson AGX Xavier and Jetson AGX Orin
Heat Sink Type: Straight fin
Heat Sink Attachment: Stainless steel screw
Installation Guide: N/A
Thermal Performance: See detail
Mechanical Drawing: See detail

NVIDIA Heat Sinks Features & Benefits

  • Designed to fit the NVIDIA® Jetson AGX Xavier™ and Jetson AGX Orin™ modules.
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Mounting Screws - M3x0.5 (3mm standard) - Thread length: 30
  • Recommended through hole size in PCB is 3.40 mm
Product Details
Part Number Lifecycle Status Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM FINISH Data Sheet RoHS & REACH
ATS-NVP-3275-C3-R0 ACTIVE 100.0 87.0 16.0 N/A Chomerics T412 Black Anodized download data sheet

Thermal Performance
Schematic Image AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip.
100 0.5 N/A N/A
200 1.0 0.5 N/A
300 1.5 N/A N/A
400 2.0 0.3 N/A
500 2.5 N/A N/A
600 3.0 0.3 N/A
700 3.5 N/A N/A
800 4.0 0.2 N/A
  • Fan not included. Fan type is specific to individual customer requirements and needs to be independently sourced.
  • Dimensions A and B refer to heat sink size.
  • Dimension C is the heat sink height from the bottom of the base to the top of the fin field.
  • Dimensions D and E refer to the mounting hole pattern C-C (center to center)
  • Thermal performance data are provided for reference only. Actual performance may vary by application.
  • ATS reserves the right to update or change its products without notice to improve the design or performance
  • ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
  • Contact ATS to learn about custom options available.

ATS-NVP-3275-C3-R0   (Data Sheet)
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
download data sheet
ATS-NVP-3275-C3-R0
Mechanical Drawing - FUSED MODEL (used for Form and Fit use)
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