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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - June 2011

Current Issues

June 2011


Phase Change Materials and Transient Loads

In the Thermal Management field, phase change materials (PCMs) have been studied for many years, and they have been put to many uses.  They have been changed as thermal interface materials (TIMs) and for thermal energy storage.  This article examines the latter application and includes temperature and time curves as illustrations.


Modern Test Equipment for TIM Testing

The quality of thermal interface materials (TIM) has become increasingly important as the ever increasing dissipation level of ICs requires more sophisticated solutions to reduce the thermal resistance Rth along the heat-flow path.  In this article, several international test devices are examined.



The Benefits of Supply Air Temperature Control in the Data Centre

Controlling the temperature in a data centre can be critical to achieving maximum uptime and efficiency.  But, is it being controlled in the right place.  In this article, the author argues for controlling temperature at the supply side of the air handler and giving back control to the facility manager.

Effects of Different Compounds and Cooling Enhancements on the Thermal    Resistance of a Stacked-Die

As the demands for faster, smaller and multifunctional mobile devices, such as cell phones, PDAs, and netbooks, keep increasing, engineers are trying to integrate more functions into a single chip.  This piece examines the stacked die package through a close study of the conductivity of die attach, mold compound or underfill material.


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