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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - November 2011

Current Issues

November 2011



Miniature-Scale Refrigeration for Thermal Management

Processor frequencies are increasing along with board densities, while spatial constraints are remaining the same, or shrinking.  Refrigeration cooling can emerge as a practical solution to advanced electronic cooling challenges.  Refinement of vapor compression cooling techniques are sure to unlock a new era of electronics where the use of ultra-high performance semiconductor devices are designed specifically for low temperature operation and are readily available. 


LED Heat Transfer and Cooling Technology Options

LED lighting is one of the fastest growing market sectors across the globe. The challenge that a designer or producer of such product has is the alignment of the cooling system/solution with the deployment-site requirements and its marketplace acceptance.  In addition to packaging issues, this article explores the role of junction temperature on light output and useful life.


Cooling High Power Electronics with Microchannels 

In recent years, as computing power densities have continued to increase, it has come to the point where the traditional air cooling solution is becoming less and less able to keep up with today’s power dissipation requirements. No single technology has yet been declared the frontrunner in the race to keep the next generation of computers cool, but liquid cooling and the use of microstructures in heat exchangers have been the subject of much exploration.


Understanding Cold Plate Manufacturing for Deployment in Electronics Equipment

The most important rule in the thermal management of electronics devices is to design cooling systems to maintain the device junction temperature below a set limit called maximum junction temperature. The most common and economical method for cooling devices is air cooling. However, to deal with increasingly amplified heat rejection issues, more and more engineers are turning to liquid cooling.


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