ATS-TI1OP-521-C1-R1 13.9 x 50.0 x 25.0 mm &BGA Heat Sink - High Performance&Device Specific - TI

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ATS-3012-C5-R0-EXPLODED

*Image above is for illustration purpose only..

13.9 x 50.0 x 25.0 mm BGA Heat Sink - High Performance Device Specific - TI
Heat Sink

Product Details

ATS Part#: ATS-TI1OP-521-C1-R1
Description:13.9 x 50.0 x 25.0 mm BGA Heat Sink - High Performance Device Specific - TI
Component Specific:N/A
Heat Sink Type:TI
Heat Sink Attachment:Heat Sinks Come with Two Threaded Mounting Holes
Installation Guide:N/A
Thermal Performance:See detail
Mechanical Drawing:See detail

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Product Details

Designed specifically for TI’s Module #TPA3116, (#TPA3116D2EVM), #TPA3118, (#TPA3118D2EVM), #TPA3130, (#TPA3130D2EVM)
Heat sinks come with 2 4-40 taped threaded holes
Optimized for natural convection air cooling
Black anodized for maximum heat dissipation

Specifications

Part Number	Lifecycle Status	Length (mm)	Width (mm)	Height (mm)	Fin Tip to Fin Tip (mm)	TIM	Finish
ATS-TI1OP-521-C1-R1	ACTIVE	13.9	50.0	25.0	N/A		BLACK-ANODIZED

Notes
Thermal Performance
Technical & Mechanical Data

Thermal Performance

Schematic Image.	Air Velocity		Thermal Resistance
Schematic Image.	(ft/min)	(m/s)	°C/W Unducted Flow	°C/W Ducted Flow
Image above is for illustration purpose only. A: Length B: Width C: Height D : Fin Tip to Fin Tip.*	100	0.5	N/A	N/A
	200	1.0	N/A	N/A
	300	1.5	N/A	N/A
	400	2.0	N/A	N/A
	500	2.5	N/A	N/A
	600	3.0	N/A	N/A
	700	3.5	N/A	N/A
	800	4.0	N/A	N/A

ATS-TI1OP-521-C1-R1 (Data Sheet) 13.9 x 50.0 x 25.0 mm BGA Heat Sink - High Performance Device Specific - TI
ATS-TI1OP-521-C1-R1 CAD MODEL (Fused Model) - use for Form and Fit
superGRIP™ Installation & Removal
superGRIP™ Clearance Guidelines
ATS-maxiGRIP Installation Guidelines
ATS-maxiGRIP Clearance Guidelines
RoHS Obtain RoHS Certificate