Webinar: Heat Pipes & Vapor Chambers – How They Work and Their Deployment in Electronics Thermal Management, 10-22-20, 2PM EST

Heat pipes and vapor chambers are often lumped into liquid cooling, but, they are not actually cooling they are in fact moving heat from a hot location to another location where it is dissipated. And how they operate, how to choose them, and how to deploy them is a very important part of the thermal engineer’s toolbox. And we have a free webinar on this topic to help train you.

Heat Pipe Diagram showing Heat Flow

Our webinar “Heat Pipes & Vapor Chambers – How They Work and Their Deployment in Electronics Thermal Management” is being held at 2PM Eastern time on 10-22-20. In this webinar we’ll answer questions such as:

  • How do heat pipes and vapor chambers work?
  • Why heat pipes are not liquid cooling?
  • When is it best to use a heat pipe and when is it best to use a vapor chamber?

The webinar will be recorded, and for those who register, we will provide the recording for your review.

While the webinar lasts about an hour, we’ll have about 30-minutes for a Q&A afterward. Don’t delay, sign up today at the button below! NOTE: this webinar had been scheduled for 10/15 but due to scheduling conflicts, our team needed to move it to 10/22.

Have questions about heat pipes and vapor chambers? email us at ats-hq@qats.com and we’ll be happy to answer them and direct you to the right solution.

How to choose the best cold plate and deploy it for electronics cooling.

Liquid cooling has been increasing in use for many years and this corresponds to the increase in the power and density of electronics. Indeed, “The increase in computer density will continue to make air cooling less and less feasible, compared with liquid cooling. Between 2018 and 2023, the engineered fluids market is projected to grow at a CAGR of 8.8% to reach $1,304 million, from $854 million in 2018, Out of all the market’s sub sectors, it is the heat transfer fluids (cooling) segment that is expected to register the highest CAGR. ” According to an article in Electropages by Nnamdi Anyadike.

So it is important for engineers to have the tools and knowledge necessary to implement liquid cooling. And we have 3 resources that are helpful:

First, our webinar on 9-17-20 “Selecting and Designing Liquid Cold Plates for Deployment in Electronic Systems”. This webinar is live and our speaker is Dr. Kaveh Azar, Ph.D. Here’s what we’ll cover:

The use of liquid cooling systems is becoming more practical and effective for managing skyrocketing increases in power dissipation. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application? This section provides the best practices for implementing a liquid cooling system at the device level.

You can join our webinar at this link:

Second, is a tutorial on liquid cooling simulation from our webinar sponsor 6SigmaET. In this tutorial, engineers will learn how to conduct and analyze liquid cooling using thermal simulation using 6SigmaET. Click the image to get to the tutorial.

Th6SigmaET Tutorial on liquid cooling simulation

Third, we have an Engineering eBook from ATS available on liquid cooling. Engineers are welcome to download it without registering, just click the following link and get your PDF copy:

What is a thermoelectric cooler and where is it used in cooling electronics?

Thermoelectric coolers (TEC) are interesting devices. Also known as a Peltier device, due to their being invented by French physicist Jean-Charles-Athanase Peltier. A TEC can use alot of energy but when you need significant cooling, a TEC is a good solution. Learn more about them in our 2-min. video

Emerging from the Abnormal: The Rep, Distributor and Manufacturer Perspective on Emerging into a Coronavirus World – An Electronics Industry Roundtable

The coronavirus global pandemic presents unique challenges for everyone, from learning to home school, to re-opening schools, hospitals, retail, restaurants and industry, every niche of society is implementing ways to open. The electronics industry is no different.

This 60 minute pod-cast from ERA, the Electronics Representative Association, is well worth the listen. In it, Walter Tobin, ERA CEO and round table facilitator and Stephanie Tierney , round table host, welcome co-facilitators:

  • Steve Nolan, Vice President of Sales and Business Development at Advanced Thermal Solutions, Inc.,
  • Sean Sisson, Vice President North America & Latin America at RUTRONIK Electronics Worldwide
  • Bryan Teen, President at Tech Marketing;

The roundtable covers perspectives from a Manufacturer’s Representatives, Manufacturers and Distributors regarding what they think tomorrow will look like for themselves as well as the customer, how they have recently enhanced their digital online image, preparations they are making for a potential second wave of COVID-19, new and effective ways that they are communicating with their customers, and their plans for upcoming in-person meetings. Click the Sound Cloud Player below to listen in:

Thank You To Future Facilities and 6SigmaET for Sponsoring Today’s Webinar “Electronics Cooling Technologies Update: The Evolution of Thermal Management”

Our team at ATS used 6SigmaET quite a bit for a wide variety of CFD simulations. We’d like to thank them for being the sponsor of today’s webinar: “Electronics Cooling Technologies Update: The Evolution of Thermal Management