Advanced Thermal Solutions (ATS) has introduced the ATS-56002 maxiFLOW™ heat sink which is specially designed for cooling hot ASICS in narrow packages where space and airflow are limited.
The ATS-56002 maxiFLOW heat sink features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling without the need for an integral fan. The 56002 heat sink is just 4 mm high; its length and width are both 25 mm. The aluminum sink features a black anodized finish. It comes preassembled with a high performance thermal interface material (TIM) with double-sided adhesive to enhance thermal transfer. The heat sink’s thermal resistance is just 5.2°C/W at 200 ft/min airflow in ducted conditions.
To learn more, please visit qats.com by clicking to “ASIC Cooling Solutions w/Thermal Tape Attachment“.