New ATS Thermal Management White Paper: Understanding and Optimizing Thermal Via

Working with challenging design constraints is an ever present problem for board designers. Increasing bandwidths and high clock speeds require that devices be placed closely together for signal integrity. Efforts to avoid signal degradation can have an adverse effect on thermal performance, as high powered devices become more tightly coupled together. In the past, when the power density was significantly less, it was possible to cool devices with a standard PCB. But, as new design and components evolve, the need for high performance heat sinks is accompanied by the need for more intelligent PCB design. A better-designed PCB will enhance heat transfer from a device to ambient through the board. To maintain acceptable junction temperatures, along with reducing the junction-to-ambient resistance through the component case, it is often necessary to dissipate some of the device power through the board. A standard PCB is often designed with electrical performance in mind; however, using thermal vias to improve thermal performance should not be overlooked.  In our new white paper, our engineers discuss just how to do that.   Download your copy here: “Understanding and Optimizing Thermal Via” .