Qpedia Thermal eMagazine, Volume 7, Issue 7, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.
This month’s featured articles include:
Thermal Performance of Heat Sinks with Heat Pipes or Vapor Chambers for Servers
Most blade servers for data and telecommunication systems use air to cool the high power chips inside. As the power level of these chips keeps increasing, the pressure is on thermal engineers to design ever higher performance air-cooled heat sinks. In recent years, advancements in manufacturing of thinner heat pipes and vapor chambers have enabled engineers to integrate the heat pipes and vapor chambers into blade server heat sinks. To illustrate their advantages, this paper includes a comparison of five different heat sinks either with embedded heat pipes or vapor chambers for their servers, all of which outperform copper heat sinks.
Designing Efficient Fans for Electronics Cooling Applications
In modern day equipment racks, the power consumed by the cooling fans represents a significant percentage of the overall system power budget. With the advent of data centers and their large energy costs, the issue of cooling power is exacerbated. It is, therefore, becoming crucial to design and implement methods for reducing data centers’ power consumption. This article presents a review of methods available for reducing energy consumption through increasing fan efficiency. Three main ways of improvement by optimization will be discussed: motor and electronic driver optimization, fan aerodynamic optimization and surrounding inlet/outlet equipment optimization.
Industry Developments: EV Battery Thermal Management
As electric vehicles and hybrid electric vehicles become more sophisticated, demands are growing for greater battery efficiency and life, and longer driving range. Achieving this must include improvements in thermal management. For car enthusiasts, this article offers some interesting battery technologies and perhaps some guidance on which models to consider for the future.
Technology Review: Fan Heat Sinks, 2007 – 2012
In this issue our spotlight is on fan heat sinks. There is much discussion about their deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.
& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.
EXCLUSIVE OFFER! Look inside for a discount code for coolingZONE-13, which will be held October 21-23, 2013 in Boston. Qpedia, coolingZONE’s official media sponsor is matching coolingZONE’s 15% discount with another 15% – saving you 30% off the registration price for the thermal management industry event of the year. Don’t miss out on this exclusive offer to Qpedia subscribers.
Download the issue now.
Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.