The monthly issue of Qpedia has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.
This month’s featured articles include:
Application of TECs to Thermal Management of 3D ICs
From the thermal perspective, 3D stacked chips pose different challenges than what has been experienced in 2D packaging. For example, the heat dissipation of 3D ICs is highly non-uniform and multidirectional, due to the intrinsic chip architecture and the available real estate. When cooling at sub-ambient temperatures is necessary, the small footprint of a 3D chip becomes an impediment to deploying a cooling solution. Additionally, precision temperature control becomes difficult, since the surface to be controlled may be buried deep in the 3D stack. In response to cooling concerns about 3D ICs, this article presents a review of methods available for cooling 3D ICs to sub ambient temperatures using TECs.
Challenges in Testing Thermal Interface Materials
When choosing a thermal interface material (TIM), most of the time we look at the datasheet and find the thermal impedance if it is a solid material or the thermal conductivity if it is grease. Then, we calculate the thermal resistance and temperature rise with those numbers. But, how do we know that a TIM is performing as advertised? Can we really tell if one TIM will perform better than another, based on their specs? Additionally, the material presented in this article suggests that the data printed in TIM datasheets should be evaluated carefully to ensure that the testing procedures are similar to the actual application. Furthermore, even with the existing standards, many variables still exist.
Industry Developments: Portable Cooling Systems
Buildings and rooms constructed to house data centers are getting larger, more congested and warmer. Many of these structures have sophisticated thermal management systems featuring high-powered coolers or harnessing cold local water or air. For some needs, however, a portable cooling system can provide a much simpler and less costly solution. These systems can deliver direct cooling relief to equipment hot spots, and some can lower a roomâ€™s temperature when a central cooling system is inadequate or nonexistent.
Technology Review: Enhancing Heat Transfer on Surfaces
In this issue our spotlight is on enhancing heat transfer on surfaces. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.
Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.
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