The first Qpedia Thermal eMagazine of 2015 has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues
Featured articles in this month’s issue:
Modeling Vapor Chambers as a Heat Spreading Device in CFD
Despite the ongoing trend which demands higher power dissipation with smaller devices, the proper junction temperature must be maintained in order to meet performance and reliability requirements. This article discusses how vapor chambers can be modeled in CFD for effective spreading of the heat dissipation of a component which is smaller than a heat sink.
Application of TEC Using a Heat Exchanger for Sub-Ambient Liquid Cooling
Thermoelectric modules are a compact electronics cooling option for applications that require simple integration, quiet operation and acceptable reliability. Though sub-ambient temperatures can be achieved with the application of thermoelectric modules, they come with the limitation of heat flux resulting in lower coefficient of performance. This article examines how using a thermoelectric chiller can overcome a thermoelectric module’s limitation and be a beneficial electronics cooling method.
Industry Developments: Advanced Packaging Materials for Electronic Components and Systems
A number of high performance materials are now available for electronic housings and packages and provide advantages over traditional choices. Advanced composites are lighter, more weather resistant and have increased reliability and thermal performance. This article will review the latest advanced packaging materials that are available on the market and discuss the thermal management and electronics packaging benefits they hold.
Technology Review: Heat Exchangers Using Two-Phase Flow
In this issue our spotlight is on heat exchangers using two-phase flow. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.
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