Engineers at Advanced Thermal Solutions, Inc. (ATS) were brought into a project to assist a client with cooling a PCB that was going to be installed in telecommunications data center. The board currently had heat sinks embedded with heat pipes covering the two hottest components but the client wanted a more reliable and cost-effective solution.
ATS engineers used the company’s patented maxiFLOW™ heat sinks to replace the heat pipes and through analytical and CFD modeling determined that by switching to maxiFLOW™ the junction temperature and case temperature would be below the maximum allowed.
• Challenge: The client had a new PCB over which air could flow from either direction and two of the highest power dissipating components were on opposite sides.
• Chips/Components: WinPath 3 and Vector Processor
• Analysis: Analytical modeling and CFD simulations determined the junction temperature with air going from left-to-right and right-to-left and ensured it would be lower than the maximum allowable (100°C for one component and 105°C for the other).
• Test Data: With air flowing from left-to-right, CFD simulation determined that the junction temperatures would be 89.3°C and 101.4°C – below the maximum temperatures of 100°C and 105°C. With air flowing from right-to-left, the junction temperature of the most power-dissipating component was 100°C, which was right at the maximum, and the second was at 87°C, which was below it.
• Solution: The original heat sinks embedded with heat pipes were switched for maxiFLOW™ heat sinks, with their placement offset slightly to create a linear airflow, and the same levels of thermal performance were achieved.
• Net Result: The client received the required level of cooling in the PCB, regardless of the direction of air flow, and with a more reliable and cost-effective solution than had been previously been in use.