Author Archives: Rebecca ODay

Nanoparticles to Enhance the Thermal Management of Electronics

Posted on February 22, 2022 | 2 comments

The addition of nanoparticles to a coolant are an alternative approach that can be considered to improve the performance of a liquid cooled system or perhaps to further reduce the size of such a system. But nanoparticles are not necessarily well known by engineers engaged in thermal management. This list of material may help.

The addition of nanoparticles to a coolant are an alternative approach that can be considered to improve the performance of a liquid cooled system or perhaps to further reduce the size of such a system. But nanoparticles are not necessarily well known by engineers engaged in thermal management. This list of material may help.

First, a new paper by Moita, Moreira and Pereira, does an excellent job of reviewing nanofluids for the next generation of thermal management. This paper contributes to the body of knowledge in this space by looking at typical nanoparticle/base fluid mixtures used and combined in technical and functional solutions. It covers the science of nanofluids and their practical application. You can download this open-access paper from the Multidisciplinary Digital Publishing Institute, at this link (download is a PDF): Nanofluids for the Next Generation Thermal Management of Electronics: A Review

Second, ATS was fortunate enough to have had on our research staff, Dr. Reza Azizian. He and others authored a white paper titled “Nanofluids in Electronics Cooling Applications”. This piece discusses the theory and use of nanofluids for thermal management. We’ve posted that paper on the ATS blog here: Nanofluids in Electronics Cooling Applications.

We hope you find these resources helpful. Like always, if you have trouble accessing them, drop us a comment and we’ll get you a copy.

Nanoparticles Shapes & Forms Image used by permission from the artist normaals

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Posted in Liquid Cooling, Nano-technology, Thermal Design

Aluminum Vapor Chambers Create a Lightweight and Lower Cost Method for Thermal Management

Posted on February 18, 2022 | 1 comment

Learn about how vapor chambers can be a key part of your thermal management solutions in this article. And learn about ATS’ off the shelf vapor chambers.

The ATS family of Aluminum vapor chambers are the largest and broadest set of off the shelf vapor chambers available today. From 25x25mm (1x1in) to 250x250mm (9.8×9.8in). Made in the USA, the vapor chambers are also available in Copper and Titanium.

The ATS family of Aluminum vapor chambers are the largest and broadest set of off the shelf vapor chambers available today. From 25x25mm (1x1in) to 250x250mm (9.8x9.8in).

==> See our entire line of Aluminum Vapor Chambers, off the shelf, at ATS’s web site: https://www.qats.com/Consulting/Heat-Pipe-and-Vapor-Chamber-Design

What are vapor chambers?

Vapor chambers, available in different metal types, use both boiling and condensation to maximize their heat transfer ability. They feature a solid metal enclosure with a wick structure lining the inside walls. The inside of the enclosure is saturated with a working fluid at reduced pressure. As heat is applied at one side of the vapor chamber, the fluid near the heat source reaches its boiling temperature and vaporizes. The vapor then travels to the other side of the vapor chamber and condenses into liquid. The condensed fluid returns to the hot side via the gravity or capillary action, ready to vaporize again and repeat the cycle. Heat sinks with embedded vapor chamber are lighter than solid metal heat sinks, which can make them more suitable for applications which are weight sensitive. you can learn about vapor chambers at the many articles on our blog at this link:https://www.qats.com/cms/category/vapor-chamber/


DOWNLOAD Our free engineering eBook “Vapor Chambers and Their Roles in Thermal Management of Electronics”

==> Our free engineering eBook “Vapor Chambers and Their Roles in Thermal Management of Electronics” can be downloaded here from ATS’ web site https://www.qats.com/cms/engineering-ebook-vapor-chambers/

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Posted in Vapor Chamber

How Chillers Are Used in the Liquid Loop and How to Choose the Right Fluid

Posted on February 15, 2022 | 12 comments

Chillers can be a key component in the liquid loop. They serve the function of conditioning the coolant before it heads back into the cold plate in a liquid loop. The standard refrigeration cycle of recirculating chillers is displayed below in Fig. 1.

Heat Exchanger
An example of a standard liquid cooling loop using a heat exchanger to transfer heat from the liquid to the ambient. (Advanced Thermal Solutions, Inc.)

The choice of the chiller and the fluid are an important part of the creation of the liquid loop. ATS has some resources to help engineers in this work.

First, engineers can get some help identifying the right fluid to use in their liquid loop with our article “Engineering How-To: Choosing the Right Fluid to Use with Cold Plates“. While water is the most common fluid, our article helps engineers with a specification grid on which fluid to use given different applications.

Another helpful resource for engineers is our article, “Cold Plates and Recirculating Chillers for Liquid Cooling Systems“. This article helps engineers understand the use of both cold plates and chillers deployed in the liquid loop. We also include a comparison of ATS and other industry chillers for quick reference for engineers.

But what if your new to how the liquid cooling loop works? Our 2 min. video walks engineers through. The video “What is a Cold Plate and How Does it Work” is a 2 minute video on the ATS YouTube Channel showing how the liquid loop works.

The Liquid Cooling Loop for thermal management of electronics
The liquid cooling loop and some key features of

Finally, ATS has a line or recirculating, immersion and TEC based chillers that engineers can deploy in their liquid loop to efficiently cool high power electronics. You can learn about them on our web sit here: “ATS Family of
recirculating, immersion and TEC based chillers“.

ATS Family of Recirculating, TEC Based and Immersion Chillers
ATS Family of Recirculating, TEC Based and Immersion Chillers

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Posted in Active, cooling, Liquid Cooling

What are Peltier Coolers and how do you choose one for electronics cooling?

Posted on February 11, 2022 | 1 comment

How do Peltier Coolers, or Thermoelectric coolers (TEC), work and how do you choose one for electronics cooling?

Thermoelectric coolers (TEC) are interesting devices. Also known as a Peltier device, due to their being invented by French physicist Jean-Charles-Athanase Peltier. A TEC can use alot of energy but when you need significant cooling, a TEC is a good solution.  We have some resources for you to assist you in how to use them:First, we have a white paper from Qpedia Thermal eMagazine on “How to Select a Peltier Cooler for Cooling or Heating Electronics” at this link on our web site: How to choose a Thermoelectric Cooler.

Second up is a video on what a TEC is. Below is a link to a 2-minute video on our YouTube Channel that gives a quick tutorial on what a TEC is and how they operate.

Link to a video on YouTube that tells what a Thermoelectric or Pelier cooler is for electronics

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Posted in TEC, thermal electronic coolers

Edge Computing Applications Use Device Level Cooling to Ensure Performance and Reliability

Posted on February 9, 2022 | Leave a comment

Edge computing devices are often installed environmentally severe and/or remote locations where reliable, long-term operation is essential. It is critical to thermally manage the CPUs, FPGAs, GPUs and other processing devices housed inside. Active cooling from ATS fanSINKs provides the cooling airflow continuously needed at the device level.

fanSINKs feature cross-cut, straight fins that maximize fan airflow for more efficient cooling. They are available for component packages from 27mm-84mm. Depending on their size, fanSINKs can be securely clipped onto a device with the ATS maxiGRIP attachment system, or with PEM screws or push pin hardware for direct attachment to the PCB. Smaller fanSINKs attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. Larger size fanSINKs fit tightly on components and attach firmly to the PCB with standoff and spring hardware.

fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. Fans for use with fanSINKs are customer specified and provided.

fanSINKS can be purchased via ATS’s global distribution network, including Mouser and Digi-Key and Sager. Also, Sager provides customer specific value add of fans to meet customer application requirements.

==> Learn about our Edge Computing and Appliance fanSINKS at ATS’s website

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Posted in Fan, Fans, heat sink, Heat Sink Attach, Heat Sinks