Category Archives: Engineering & Science Chat

ATS walks the 94th International Four Days Marches for UNICEF

Advanced Thermal Solutions, Inc. (ATS) announces its participation in the 94th International Four Days Marches Nijmegen. In July, 2010, senior executives at ATS, including Dr. Kaveh Azar, President/CEO, Sharon Koss, VP of Operations, and Norbert Engelberts, Director of ATS-Europe BV, will proudly partake in the largest marching event in the world. Since 1916, participants of this historic event walk 160 kilometers through the Netherlands. Over the course of 4 days, participants walk 40 k per day through the cities of Elst, Wijchen, Groesbeek, and Cuijk.

“At ATS, we believe that we have an environmental responsibility to our employees, customers and the general public, but our commitment also extends to support international humanitarian efforts” says Dr. Kaveh Azar, President/CEO of ATS. To this end, for every kilometer walked in the Four Days Marches, ATS will donate money to UNICEF, supporting the belief that nurturing and caring for children are the cornerstones of human progress.

Every day, more than 24,000 children die – and they don’t have to. UNICEF takes proven, low-cost methods that saves children’s lives and makes them available regardless of income, ethnicity or location. ATS seeks support to help them make a difference in the fight for child survival by making a tax-deductible donation to UNICEF. For each dollar you donate, ATS will match your charitable contribution. This donation will provide children with:

  • Lifesaving vaccines and insecticide-treated bed nets
  • Emergency relief following natural disasters
  • Educational opportunities and School-in-a-Box kits
  • And much more

Donating is easy to do online or by Fax. To contribute using the easy online donation form, please visit our ATS UNICEF Donation Page at  Unicef. Help ATS and UNICEF reach their goal and support the lifesaving programs of UNICEF for children around the world today.

Thermal Management Webinars from ATS now featured at Digi-Key

If you do any purchasing at Digi-Key you can now also sign up for any of ATS’s thermal management webinars right from the ATS site at Digi-Key! ATS is delighted to be partnered with Digi-Key for distribution of our heat sink and heat sink attach products. Our webinars are long on technical data and short on marketing fluff, so, we invite you to have a look at ATS’s “store” at Digi-Key and while your there, sign up for a free webinar (under the events and seminars tab).

iTHERM 2010 Thermal Conference Bally’s, Las Vegas, NV, USA, June 2-5

iTherm, “an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems” is being held June 2-5 at Bally’s, Las Vegas, NV, USA.

iTherm has a preliminary schedule up on their site here. There are MANY scheduled speakers, but a few to highlight include:

  • Scott Noteboom, Yahoo
  • Jesse Galloway, Amkor Technology
  • Maxat Touzelbaev, Advanced Micro Devices
  • Tomoyuki Hatakeyama, Toyama Prefectural University
  • Stanton Weaver, General Electric Company Global Research
  • Woo Young Kan, Samsung Electronics
  • Suresh V. Garimella, Purdue University
  • Robert Tozer, Hewlett Packard Critical Facilities Services
  • Darvin Edwards, Texas Instruments
  • Kripa Varanasi, Massachusetts Institute of Technology
  • David H. Altman, Raytheon Integrated Defense Systems

The list of seminars and panel topics runs 27 pages but here are a few:

  • Numerical Modeling of Data Center with Transient Boundary Conditions
  • Reducing Energy Usage in Data Centers through Control of Room Air Conditioning Units
  • From Chip to Cooling Tower Data Center Modeling: Part I Influence of Server Inlet Temperature and Temperature Rise across Cabinet
  • Heat Transfer Enhancement with Laminar Liquid-Gas Slug Flows
    Thermal Performance of Microchannels with Wavy Walls for Electronics Cooling
  • Numerical Study of aNovel Passive Micromixer Design
  • Open Side Car Heat Exchanger that Removes Entire Server Heat Load without any Added Fan Power
  • Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Impinging Jets
  • Comparison between Experimental Results and CFD Simulations for Air Flows in a Thin Electronics Casing Model

See the full list and more at iTHERM 2010 Conference Page.

Cooling Zone 2010 Business & Technology Summit will be held August 18-19 at the Crowne Plaze Hotel, Natick, MA

[Editor Note:  To learn about coolingZONE 2011, please click to our post, “Thermal Management Course Coming to coolingZONE Summit, October 4, 2011” ]

The Cooling Zone 2010 Business and Technology Summit will be held August 18-19 at the Crowne Plaze Hotel, in Natick, MA.  Keynote speaker is Dr. Suresh V. Garimella, Director (NSF Cooling Technologies Research Center, School of Mechanical Engineering and Birck Nanotechnology, Center Purdue University).

Special guest?  Tony Koryban teaching, “Unlearning the Myths of Cooling Electronics”

What’s it all about?

CoolingZone’s Business & Technology Summit is the premier annual gathering of electronics thermal management professionals from around the world. It is different from all conferences in that selected topics are covered in one-hour lecture by experts in each field.

Learn more and register here: http://www.coolingzone.com/summit2010/

Novel Concepts thermal calculators give you free tools to get your thermal designs done faster

Novel Concepts has a series of on-line tools to help you get your thermal development work done faster. The tools are free at their site here and include:

  • Slab Thermal Resistance: This one-dimensional steady-state heat conduction calculator provides the thermal resistance through the height axis of a solid slab, given uniform heat input and output, and having insulated sidewalls.
  • Cylinder Thermal Resistance: This one-dimensional steady-state heat conduction calculator provides the thermal resistance through the height axis of a solid cylinder, given uniform heat input and output, and having insulated sidewalls.
  • Hollow Cylinder Thermal Resistance: This one-dimensional steady-state heat conduction calculator provides the thermal resistance through the sidewall of a hollow cylinder, given uniform heat input and output, and having insulated ends.
  • Slab Thermal Resistance With Constriction: This two-dimensional steady-state heat conduction calculator provides the thermal resistance through the height axis of a solid slab, flat heat pipe, or heat spreader, including the thermal constriction resistance resulting from a heat source that is smaller than the slab, given uniform heat input and output, and having all other surfaces insulated.
  • Slab Mass Thermal Resistance: This one-dimensional transient heat capacitance calculator provides the thermal resistance of a solid slab, given the mass thermal properties, finite heat input, and being fully insulated.
  • Mass Flow Thermal Resistance: This one-dimensional steady heat capacitance calculator provides the thermal resistance of a mass flow system, given the mass thermal properties and flow rate.
  • Slab Fin Efficiency: This one-dimensional steady-state heat conduction calculator provides the fin efficiency or effectiveness of a slab or cuboid shaped fin, given uniform cross-sectional area, uniform heat input, and insulated ends.
  • Pin Fin Efficiency: This one-dimensional steady-state heat conduction calculator provides the fin efficiency or effectiveness of a pin or cylindrical shaped fin, given uniform cross-sectional area, uniform heat input, and insulated ends.
  • Forced Convection Heat Sink Thermal Resistance: This steady-state forced convection heat sink calculator provides thermal resistance and pressure drop, given uniform heat input and uniform air flow. This model is based on the fluid properties of air at 50°C, and includes entrance and exit pressure loss effects, and excludes any base conduction resistance.
  • Peltier (thermoelectric) Cooler Thermal and Electrical Performance:
    This steady-state calculator provides the thermal and electrical performance of a Bismuth Teluride based Peltier (thermoelectric) cooling system, as a function of ambient temperature, hot and cold side heat exchanger performance, thermal load, Peltier module thermopile) geometry, and Peltier electrical parameters.

You can check these tools out for yourself by visiting them at this link: Novel Concepts Thermal Calculators