Category Archives: Fan

How to Understand Fan Curves and Optimum Operating Points


Fans, or other air movers, are a critical part of any system level thermal management solution. There are cases where a fan is not preferred, such as in medical equipment (see our earlier post on that topic here), some military applications and in some consumer applications. And, fans do present the unwanted chance of mechanical failure being introduced into a system.

In a white paper written by ebmpapst, they note that:

Fans create a flow of air, which they can then force through equipment that needs cooling. The necessary output is determined from the flow rate and the required static pressure. If the airflow through the equipment is restricted to any great extent by built-in components or bends and junctions, then this will lead to a loss of pressure; the fan will try to compensate for this by an increase in the static pressure, though the fan will have to work harder than in free air operation. The characteristic curve of the fan gives precise information about the flow rate at specific static pressures.

Understanding these curves is critical and ebmpapst has a good, introductory white paper to help you understand them. You can get your copy of their quick and useful read by clicking:  Fan Curves and Optimum Operating Points.

ATS, Inc. announces “on demand” Webinar for Thermal Engineers: Methodologies for Fan Characterization

ATS, Inc. is announcing a new “on-demand” webinar from our thermal engineering team, “Methodologies for Fan Characterization”. This webinar is ready for download and listening 24 hours day from the ATS web site.

Topics covered include:

  • What are the fan types and points of application?
  • Understanding how fans operate and the effect of bypass flow on their operation
  • Fan selection
  • Fan assemblies and their implementation
  • Use of fan laws for sizing
  • Managing acoustic noise
  • Fan characterization

To take part in this webinar, just click to our site to reach the webinar at: Methodologies for Fan Characterization

How to use fan trays in electronic enclosures for thermal management; an ATS Thermal Labs “how to” white paper

While heat sinks do a terrific job of moving heat from a hot chip, cool air (or another moving liquid) is very helpful to move that heat off the chip and out of the system. Individual fans are one way to approach this problem. Another is by use of a fan tray.

A fan tray is an array of fans put together in a removable tray of some kind. There are various types and configurations based on whether you need to move air for a computer server, telecomm central office equipment or medical equipment. Fan trays are very helpful in developing a system level thermal management solution.

While on the surface of it, a fan tray appears to be no more than a number of fans placed in a frame there is actually quite a bit more there. From the kinds of fans, to the circuitry used to control them, fan trays are really an air moving system that, when engineered right, can bring real benefit.

ATS’s Thermal white paper will give you a basic sense for what’s involved, so click to it at our site now, “How to use fan trays in electronic enclosures; an ATS Thermal Labs “how to” white paper.

How system airflow affects active heat sinks: ATS “how to” white paper

In our post, “Active heat sinks direct air on hot chips but are they always the right choice” we wrote about the benefits and drawbacks of using an active heat sink or fansink.  We also talked about system design approaches that should be considered by a thermal engineer.  If a system is designed well, be it a workstation or printer, active heat sinks with fans probably won’t be necessary.  But if you do decide to go the way of using an active heat sink you should be aware of how overall system air flow affects fan sink performance.

ATS has produced a white paper that can help you understand this important issue. Cooling fans consist of an aggregate of airfoils, i.e., blades positioned around a hub that is driven by an electric motor. Due to their airfoil nature, a pressure differential is required across the blades to create the required flow. Therefore if this pressure differential is disturbed, fans will suffer performance degredation. Our white paper addresses this important issue so you can implement fan sinks in the best way possible. You may download our white paper from our qats.com by visiting the link, “How system airflow affects active heat sinks

Active heat sinks direct air on hot chips but are they always the right choice?

Active heat sink, fan-on-sink and other such names all define a heat sink type that contains a fan which directs air onto the semiconductor it is cooling (click to see a side by side example of an active heat sink with a passive heat sink).  Are these kinds of heat sinks all they are purported to be or are their downsides to these heat sinks too?

First, let’s look at some benefits to using active heat sinks

  • You can direct air flow to the hottest semiconductor’s in your system
  • You may be able to makeup for poor internal air flow system design where you simply can’t get enough air to your processor and so a local air mover assist is needed.
  • They may make sense if you design add-in boards with a hot main processor and you are not sure where your add-in board is going to end up being used and you must insure adequete airflow.
  • Active heat sinks are a terrific choice for directed air onto prototype boards or chips during bench debug.  Rather than taking a small desktop fan and blowing it on your alpha board full of probes, clamping or taping on an active heat sink onto the target processor can be an excellent way to spot cool your hot chip while you debug.

As with any active device introduced into a system, there are downsides as well.

  • Active heat sinks can have fan failures, resulting in the components they are cooling overheating or kicking into a  thermal shutdown.
  • Active heat sinks are many times (though not always) very tall, limiting the kinds of cases or chassis they may be used in.
  • Active heat sinks may not necessarily be increased in size to take advantage of more surface area for convection cooling.
  • Active heat sinks can be expensive and choosing one can be tricky. The least expensive version may house fans using substandard components.  The better ones may use fans with ball bearings but the price can put this solution out of a designers target cost budget.

If you are starting your system design from the beginning, the best move is to design the system to optimize cooling.   Insure your PCB boards are designed in such a way as to optimize for thermal design.  Check your system to design for the best system fan placement.  Create your system design so that flow is designed without blockages or potential for air pooling.   Finally, you want to make sure that if you do need heat sinks, that the combination of size, thermal interface material and heat sink attach are used to get the most that you can out of a passive heat sink approach.