Tag Archives: qpedia thermal emagazine

Download the New Issue of Qpedia

Qpedia_jul13_coverQpedia Thermal eMagazine, Volume 7, Issue 7, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Thermal Performance of Heat Sinks with Heat Pipes or Vapor Chambers for Servers

Most blade servers for data and telecommunication systems use air to cool the high power chips inside. As the power level of these chips keeps increasing, the pressure is on thermal engineers to design ever higher performance air-cooled heat sinks. In recent years, advancements in manufacturing of thinner heat pipes and vapor chambers have enabled engineers to integrate the heat pipes and vapor chambers into blade server heat sinks. To illustrate their advantages, this paper includes a comparison of five different heat sinks either with embedded heat pipes or vapor chambers for their servers, all of which outperform copper heat sinks.

 

Designing Efficient Fans for Electronics Cooling Applications

In modern day equipment racks, the power consumed by the cooling fans represents a significant percentage of the overall system power budget. With the advent of data centers and their large energy costs, the issue of cooling power is exacerbated. It is, therefore, becoming crucial to design and implement methods for reducing data centers’ power consumption. This article presents a review of methods available for reducing energy consumption through increasing fan efficiency. Three main ways of improvement by optimization will be discussed: motor and electronic driver optimization, fan aerodynamic optimization and surrounding inlet/outlet equipment optimization.

 

Industry Developments: EV Battery Thermal Management

As electric vehicles and hybrid electric vehicles become more sophisticated, demands are growing for greater battery efficiency and life, and longer driving range. Achieving this must include improvements in thermal management. For car enthusiasts, this article offers some interesting battery technologies and perhaps some guidance on which models to consider for the future.

 

Technology Review: Fan Heat Sinks, 2007 – 2012

In this issue our spotlight is on fan heat sinks. There is much discussion about their deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

 

& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

 

EXCLUSIVE OFFER! Look inside for a discount code for coolingZONE-13, which will be held October 21-23, 2013 in Boston. Qpedia, coolingZONE’s official media sponsor is matching coolingZONE’s 15% discount with another 15% – saving you 30% off the registration price for the thermal management industry event of the year. Don’t miss out on this exclusive offer to Qpedia subscribers.

Download the issue now.

 

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

Qpedia is Hot of the Press

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Qpedia Thermal eMagazine, Volume 7, Issue 5, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Next Generation Processor Cooling and Power Trends

CMOS semiconductor technology has been faithfully following Moore’s Law for several decades now. This Law states that the number of transistors per unit area doubles about every year [1]. This trend is likely to continue in the foreseable future. In addition, two other technical trends will accompany the roadmap of future processors: manycore chip multiprocessors and 3D integration. This article presents a review of recent predictions for future 2D and 3D manycore processors architectures.

Thermal Performance of Thin Flat Heat Pipes

As the demands for faster, smaller and multifunctional mobile devices, such as cell phones, PDAs, and netbooks, keep increasing, both system and electronic engineers are trying to integrate more functional models into smaller and thinner devices. This has forced thermal engineers into looking for more innovative and effective passive methods to cool semiconductor devices with their increasing power density. Thin flat heat pipes, whose thickness is less than 1.5 mm, have found more applications on mobile devices and certainly drawn more attention from researchers.

Industry Developments: Smartphone Cooling Systems

With increasingly processor-intensive apps being used on mobile devices, the steadily powerful chipsets in smartphones are running hotter than ever. Many desktop computers and larger, powerful computing systems use water cooling to keep their CPUs from overheating. Now smaller versions of these cooling systems are being employed in warm smart phones. While NEC was the first major smartphone company to launch a liquid-embedded smartphone, other manufacturers, such as Apple, Samsung Electronics and HTC are likely to soon follow in 2013.

Technology Review: Air Delivery Systems Utilizing Piezofan or Standard Fans

In this issue our spotlight is on air delivery systems using piezo and standard fans. There is much discussion about this and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.