By virtue of the fact that ATS is a provider of heat sinks and thermal management solutions to electronics, much of work is target at the junction temperature of semiconductors. We work with a lot of suppliers in this space, most recently Intel’s Sandybridge. Which leads me to the reason for addressing this topic.<\/p>\n
Are Your Heat Sinks and Thermal Management Strategy for Your Target Seminconductors Optimized or Deadended?<\/p>\n
Of all the semiconductor providers works with, ATS has done a great deal of work with Caviuim, TI and Freescale. It’s not that their processors are unusually hot, it’s that these firms recognize that ATS does a great job of optimizing a thermal design. Our case studies show a wide range of applications and successes in this optimization<\/a>.<\/p>\n With Cavium, ATS is a thermal development partner<\/a>. We’ve tackled a number of difficult designs with them and with Cavium customer’s whose design elements create very dense, high performance products but in some small and low air flow applications.<\/p>\n ATS has two off-the-shelf stocks solutions for Cavium that can be used as design starting points, The ATS-691-C2-R1 offers up a thermal resistance of .6 C\/W at 200 LFM and the ATS-725-C1-R1 offers up a thermal resistance of 2 C\/W at 200 LFM.<\/p>\n <\/a><\/p>\n","protected":false},"excerpt":{"rendered":" By virtue of the fact that ATS is a provider of heat sinks and thermal management solutions to electronics, much of work is target at the junction temperature of semiconductors. We work with a lot of suppliers in this space, … Continue reading
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