{"id":3187,"date":"2011-06-29T20:13:44","date_gmt":"2011-06-29T20:13:44","guid":{"rendered":"http:\/\/qats.com\/cms\/?p=3187"},"modified":"2016-02-19T15:27:59","modified_gmt":"2016-02-19T19:27:59","slug":"thermal-simulation-and-management-of-a-3d-stacked-chip-and-more-in-volume-5issue-5-of-qpedia-thermal-ejournal","status":"publish","type":"post","link":"https:\/\/www.qats.com\/cms\/2011\/06\/29\/thermal-simulation-and-management-of-a-3d-stacked-chip-and-more-in-volume-5issue-5-of-qpedia-thermal-ejournal\/","title":{"rendered":"Thermal Simulation and Management of a 3D Stacked Chip and more in Volume 5:Issue 5 of Qpedia Thermal eJournal"},"content":{"rendered":"<p>We&#8217;ve just released Qpedia Thermal eJournal for May 2011. This is Volume 5, Issue 5 of our monthly thermal management publication.\u00a0 We&#8217;ve got a number of good articles in this issue including the &#8220;Thermal Simulation and Management of 3D Stacked Chips.<\/p>\n<p>As Tom Tarter noted in an <a href=\"http:\/\/www.pkgscience.com\/Docs\/Thermal%20Challenges%20in%203D%20packaging%202.pdf\">August 2010 Presentation to IMAPS<\/a>:<\/p>\n<blockquote><p>3D Packaging provides increased density and performance and is a key element to meeting and exceeding Moore&#8217;s law predictions<\/p><\/blockquote>\n<p>So while stacked chip designs satisfy the ever increasing performance need, thermal management issues are core to the success of a given multi-chip design. And our article in QPedia on &#8220;Thermal Simulation and Management of a 3D Stacked Chip&#8221; will equip you to better handle this chip packages thermal challenges<\/p>\n<p>This months QPedia also addresses ATCA and Thermal Management, Miniature Refrigeration and more. To get your free copy, click to, &#8220;<a href=\"http:\/\/www.qats.com\/Qpedia\/Qpedia_Thermal_eMagazine_511_V3_lowrez-ka.ashx\">Qpedia Thermal eJournal<\/a>&#8220;.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>We&#8217;ve just released Qpedia Thermal eJournal for May 2011. This is Volume 5, Issue 5 of our monthly thermal management publication.\u00a0 We&#8217;ve got a number of good articles in this issue including the &#8220;Thermal Simulation and Management of 3D Stacked &hellip; <a href=\"https:\/\/www.qats.com\/cms\/2011\/06\/29\/thermal-simulation-and-management-of-a-3d-stacked-chip-and-more-in-volume-5issue-5-of-qpedia-thermal-ejournal\/\">Continue reading <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[160],"tags":[],"class_list":["post-3187","post","type-post","status-publish","format-standard","hentry","category-qpedia-thermal-emagazine"],"_links":{"self":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/3187","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/comments?post=3187"}],"version-history":[{"count":0,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/3187\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/media?parent=3187"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/categories?post=3187"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/tags?post=3187"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}