{"id":4474,"date":"2013-06-26T12:20:43","date_gmt":"2013-06-26T17:20:43","guid":{"rendered":"http:\/\/qats.com\/cms\/?p=4474"},"modified":"2013-06-26T12:22:10","modified_gmt":"2013-06-26T17:22:10","slug":"the-new-qpedia-thermal-emagazine-is-out","status":"publish","type":"post","link":"https:\/\/www.qats.com\/cms\/2013\/06\/26\/the-new-qpedia-thermal-emagazine-is-out\/","title":{"rendered":"The New Qpedia Thermal eMagazine is Out"},"content":{"rendered":"

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Qpedia Thermal eMagazine, Volume 7, Issue 4, has just been released and can be downloaded at: http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Back-Issues<\/a>.<\/p>\n

Featured articles in this issue include:<\/p>\n

Dropwise Condensation in Vapor Chambers<\/b>
\nConsiderable attention has been devoted in the past to the evaporation process taking place in a vapor chamber. However, increased heat fluxes at the condensation end have prompted efforts to improve the condensation performance of the vapor chambers. This article presents a review of a novel method for improving the thermal performance of a vapor chamber condensing section by using special surfaces promoting dropwise condensation.<\/p>\n

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Heat Sink Manufacturing Using Metal Injection Molding
\n<\/b><\/p>\n

Using Metal Injection Molding It is only in the last few years that metal injection molding (MIM) has gained a foothold in the thermal community and its salient advantages have become more evident. The MIM process allows intricate features to be added into the heat sink design to boost thermal performance and its production process is very scalable compared with machining. Injection molding enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom.\u00c2\u00a0 This article explore the merits of copper material in the MIM process.<\/p>\n

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Industry Developments<\/b>: Thermoelectric Modules and Coolers<\/strong><\/p>\n

Thermoelectric modules (TEMs) are rugged, reliable and quiet devices that serve as heat pumps. The real heat-moving components inside TEMs are thermoelectric coolers or TECs. These are solid-state heat pumps and are designed for applications where temperature stabilization, temperature cycling, or cooling below ambient, are required. Today, TEMs are used in electro-optics applications, such as the cooling and stabilizing of laser diodes, IR detectors, cameras (charge coupled device), microprocessors, blood analyzers and optical switches. This article explores some of the latest developments in these devices.<\/p>\n

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Technology Review: Reducing Thermal Spreading Resistance in Heat Sinks <\/strong><\/p>\n

In this issue our spotlight is on reducing spreading resistance in heat sinks. There is much discussion about how this phenomenon can be achieved, and these patents show some of the salient features that are the focus of different inventors.<\/p>\n

 <\/p>\n

Cooling News<\/strong> featuring the latest product releases and buzz from around the electronics cooling industry.<\/p>\n

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Download<\/a><\/strong> the issue now. <\/em><\/p>\n

 <\/p>\n

Not a Qpedia subscriber? Subscribe Now for free<\/strong> at: http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Subscribe-to-Qpedia <\/a>and see why over 18,000 engineers read Qpedia.<\/strong><\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Qpedia Thermal eMagazine, Volume 7, Issue 4, has just been released and can be downloaded at: http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Back-Issues. Featured articles in this issue include: Dropwise Condensation in Vapor Chambers Considerable attention has been devoted in the past to the evaporation process … Continue reading →<\/span><\/a><\/p>\n","protected":false},"author":5,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[160],"tags":[555,322,204,556,89,668,677,336,341,338,231,324,343,121,678,674,382,170,138,203,675],"class_list":["post-4474","post","type-post","status-publish","format-standard","hentry","category-qpedia-thermal-emagazine","tag-dropwise-condensation","tag-electronics","tag-electronics-cooling","tag-emagazine","tag-engineering-2","tag-heat-sink","tag-heat-transfer","tag-heatsink","tag-journal","tag-magazine","tag-manufacturing-2","tag-mechanical-engineer","tag-publication","tag-qpedia","tag-thermal-engineering","tag-thermal-management","tag-thermal-performance","tag-thermal-resistance","tag-thermoelectric-cooler","tag-thermoelectric-modules","tag-vapor-chamber"],"_links":{"self":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/4474","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/comments?post=4474"}],"version-history":[{"count":0,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/4474\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/media?parent=4474"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/categories?post=4474"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/tags?post=4474"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}