{"id":5192,"date":"2014-03-27T12:17:24","date_gmt":"2014-03-27T16:17:24","guid":{"rendered":"http:\/\/www.qats.com\/cms\/?p=5192"},"modified":"2017-01-27T14:02:27","modified_gmt":"2017-01-27T18:02:27","slug":"what-is-the-thermal-performance-of-straight-fin-pin-fin-and-other-heat-sink-geometries","status":"publish","type":"post","link":"https:\/\/www.qats.com\/cms\/2014\/03\/27\/what-is-the-thermal-performance-of-straight-fin-pin-fin-and-other-heat-sink-geometries\/","title":{"rendered":"What is The Thermal Performance of Straight Fin, Pin Fin and Other Heat Sink Geometries?"},"content":{"rendered":"

This article discusses the effects of air flow velocity on the experimentally determined thermal resistance of different heat sink designs. To be able to compare these designs, we need to first review basic heat transfer theory as applied to heat sinks. Previously published work is discussed, along with heat sink selection criteria.<\/p>\n

A device\u2019s temperature affects its operational performance and lifetime. To achieve a desired device temperature, the heat dissipated by the device must be transferred along some path to the environment [1].\u00a0 The most common method for transferring this heat is by finned metal devices, otherwise known as heat sinks.<\/p>\n

Resistance to heat transfer is called thermal resistance. The thermal resistance of a heat sink decreases with more heat transfer area. However, because device and equipment sizes are decreasing, heat sink sizes are also growing smaller. On the other hand, device heat dissipation is increasing.\u00a0 Therefore, designing a heat transfer path in a limited space that minimizes thermal resistance is critical to the effective design of electronic equipment.<\/p>\n

\"thermal<\/a><\/p>\n

The heat transfer rate of a heat sink, Q-dot, depends on the difference between the component case temperature, Tc<\/sub>, and the air temperature, Ta<\/sub>, along with the
\ntotal thermal resistance, Rt<\/sub>. This relationship is shown in Equation 1. For a basic heat sink design, as shown in Figure 1, the total thermal resistance depends on the sum of the heat sink resistance, Rhs<\/sub>, the spreading resistance in the heat sink base, Rsp<\/sub>, and the thermal interface resistance from the component to the heat sink base, Rtim<\/sub>, as shown in Equation 2.<\/p>\n

\"heat<\/a>Equation (1) and Equation (2)<\/em><\/p>\n

Therefore, to compare different heat sink designs, the thermal interface resistance, RTIM<\/sub>, and the spreading resistance, Rsp<\/sub>, was similar among the heat sinks tested.<\/p>\n

For this study, the same thermal interface material (TIM) was used with all heat sinks. This minimized the difference in the thermal interface resistance, RTIM, between heat sink tests. As is normal, the spreading resistance of a heat sink\u2019s base, Rsp<\/sub>, increased with decreasing base thickness and conductivity. It also increased with an increasing difference in the heat sink base area and the heat dissipation area [2].\u00a0 To read the full study<\/strong> and recommendations<\/strong>, please click here for the PDF<\/strong><\/a>.\u00a0 No cost or registration is required.\u00a0 Also, ATS has a family of straight fin heat sinks for sale, with dimensions from 15mm to 45mm in length, 15mm to 45mm wide, and 9.5mm to 4.5mm high, see them all here:\u00a0<\/span> ATS Push Pin Heat Sink Family<\/a>.<\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"

This article discusses the effects of air flow velocity on the experimentally determined thermal resistance of different heat sink designs. To be able to compare these designs, we need to first review basic heat transfer theory as applied to heat … Continue reading →<\/span><\/a><\/p>\n","protected":false},"author":1001005,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[26,64],"tags":[631],"class_list":["post-5192","post","type-post","status-publish","format-standard","hentry","category-heat-sink","category-thermal-research","tag-push-pin"],"_links":{"self":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/5192","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/users\/1001005"}],"replies":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/comments?post=5192"}],"version-history":[{"count":1,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/5192\/revisions"}],"predecessor-version":[{"id":7519,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/5192\/revisions\/7519"}],"wp:attachment":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/media?parent=5192"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/categories?post=5192"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/tags?post=5192"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}