{"id":5749,"date":"2014-12-01T11:31:00","date_gmt":"2014-12-01T15:31:00","guid":{"rendered":"http:\/\/www.qats.com\/cms\/?p=5749"},"modified":"2014-12-01T11:31:00","modified_gmt":"2014-12-01T15:31:00","slug":"new-qpedia-thermal-emagazine-features-articles-on-enhancing-heat-sink-performance-thermal-analysis-and-led-cooling","status":"publish","type":"post","link":"https:\/\/www.qats.com\/cms\/2014\/12\/01\/new-qpedia-thermal-emagazine-features-articles-on-enhancing-heat-sink-performance-thermal-analysis-and-led-cooling\/","title":{"rendered":"New Qpedia Thermal eMagazine Features Articles on Enhancing Heat Sink Performance, Thermal Analysis and LED Cooling"},"content":{"rendered":"<p><a href=\"http:\/\/www.qats.com\/cms\/wp-content\/uploads\/2014\/12\/Qpedia_aug14_cover.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-large wp-image-5750\" src=\"http:\/\/www.qats.com\/cms\/wp-content\/uploads\/2014\/12\/Qpedia_aug14_cover-791x1024.jpg\" alt=\"Qpedia_aug14_cover\" width=\"500\" height=\"647\" srcset=\"https:\/\/www.qats.com\/cms\/wp-content\/uploads\/2014\/12\/Qpedia_aug14_cover-791x1024.jpg 791w, https:\/\/www.qats.com\/cms\/wp-content\/uploads\/2014\/12\/Qpedia_aug14_cover-231x300.jpg 231w, https:\/\/www.qats.com\/cms\/wp-content\/uploads\/2014\/12\/Qpedia_aug14_cover-618x800.jpg 618w, https:\/\/www.qats.com\/cms\/wp-content\/uploads\/2014\/12\/Qpedia_aug14_cover.jpg 1700w\" sizes=\"auto, (max-width: 500px) 100vw, 500px\" \/><\/a>The new Qpedia issue has just been released and can be downloaded at: <a href=\"http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Back-Issues\">http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Back-Issues<\/a><\/p>\n<p>Featured in this Issue:<\/p>\n<p><strong>Experimental and CFD Analysis of a Typical Telecom Board<\/strong><\/p>\n<p>As technology in the electronics industry continues to rapidly advance, thermal management is becoming more important than ever. However, due to high competition in the electronics market, engineers are often expected to quickly solve complex thermal management challenges with the highest ROI at the start of a commonly shortened design cycle. This article will investigate three methodologies used to solve thermal management challenges found on common communications boards in order to reduce hardware re-work costs, improve product reliability, and ensure a product is released into the market without delay.<\/p>\n<p><strong>Enhancing Heat Sink Performance in Natural Convection Using EHD <\/strong><\/p>\n<p>Electrohydrodynamics is one of the most promising new methods emerging for natural convection cooling in the thermal management of electronics. EHD has the ability to cool heat sinks that do not have a system flow in addition to eliminating any noise. This article will discuss how EHD can be used to increase heat transfer for active cooling heat sinks.<\/p>\n<p><strong>LED Cooling: From Passive to Active<\/strong><\/p>\n<p>As LED lighting has become ubiquitous across the globe, LED thermal management technologies continue to advance. While passive cooling solutions are still being improved, many active cooling solutions including fan heat sinks, vortex fans, fan sinks with embedded heat pipes and liquid cooled heat sinks can provide a high level of LED cooling. This article reviews current passive and active LED cooling technologies in the industry.<\/p>\n<p><strong>Technology Review: High Capacity Air Cooling<\/strong><\/p>\n<p>In this issue our spotlight is on high capacity air cooling. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.<\/p>\n<p><strong>Cooling News<\/strong><\/p>\n<p>The latest product releases and news from around the electronics cooling industry.<\/p>\n<p><strong><a href=\"http:\/\/www.qats.com\/Qpedia\/Qpedia_v8_aug14.ashx\">Download<\/a> the issue.<\/strong><\/p>\n<p><em>Not a Qpedia subscriber?<\/em> <a href=\"http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Subscribe-to-Qpedia\">Sign up<\/a> and find out why over 18,000 engineers read Qpedia Thermal eMagazine.<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The new Qpedia issue has just been released and can be downloaded at: http:\/\/www.qats.com\/Qpedia-Thermal-eMagazine\/Back-Issues Featured in this Issue: Experimental and CFD Analysis of a Typical Telecom Board As technology in the electronics industry continues to rapidly advance, thermal management is &hellip; <a href=\"https:\/\/www.qats.com\/cms\/2014\/12\/01\/new-qpedia-thermal-emagazine-features-articles-on-enhancing-heat-sink-performance-thermal-analysis-and-led-cooling\/\">Continue reading <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":5,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[160],"tags":[],"class_list":["post-5749","post","type-post","status-publish","format-standard","hentry","category-qpedia-thermal-emagazine"],"_links":{"self":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/5749","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/comments?post=5749"}],"version-history":[{"count":0,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/posts\/5749\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/media?parent=5749"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/categories?post=5749"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.qats.com\/cms\/wp-json\/wp\/v2\/tags?post=5749"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}