eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin Cross-Cut Heat Sinks High Efficiency Design Provides a Low Pressure Drop Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 9.5 - 24.5 mm Fin Tip to Fin Tip (D) 15.0 - 45.0 mm Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape. Cross Cut Features & Benefits High efficiency cross-cut design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low Provided with pre-assembled high performance thermal tape Why ATS' Cross-Cut? Related Products Related Qpedia Articles Design Services Videos Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us Cross Cut Applications ATS’ Cross-Cut heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 9.5 - 24.5 mm Fin Tip to Fin Tip (D) 15.0 - 45.0 mm
Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape. Cross Cut Features & Benefits High efficiency cross-cut design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low Provided with pre-assembled high performance thermal tape
Why ATS' Cross-Cut? Related Products Related Qpedia Articles Design Services Videos Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us Cross Cut Applications ATS’ Cross-Cut heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why ATS' Cross-Cut? Related Products Related Qpedia Articles Design Services Videos Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us
Cross Cut Applications ATS’ Cross-Cut heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx