eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 96 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin Custom Pin Fin Heat Sinks Excellent Cooling Solution for Spatially Constrained PCB Layouts Dimensions Length (A) 10.0 - 60.0 mmWidth (B) 10.0 - 60.0 mm Height (C) 2.0 - 25.0 mm Fin Tip to Fin Tip (D) 10.0 - 60.0 mm ATS offers a wide variety of ultra-performance extruded heat sinks with high aspect ratio for applications where there is adequate airflow to take optimum advantage from these designs. Heat sink solutions are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm with 1mm increments. These heat sinks can be attached to the device with double-sided thermal adhesive, Z-clip or maxiGRIP™ technologies. Custom Pin Fin design offers an excellent cooling solution for spatially constrained PCB layouts when the direction of the airflow in the vicinity of the device is ambiguous. Custom Pin Fin Features & Benefits High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps cost low Comes standard without interface material, or with most common pressure sensitive thermal tapes as a custom option Why ATS' Pin Fin? Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW Custom Pin Fin Applications ATS’ custom pin fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Dimensions Length (A) 10.0 - 60.0 mmWidth (B) 10.0 - 60.0 mm Height (C) 2.0 - 25.0 mm Fin Tip to Fin Tip (D) 10.0 - 60.0 mm
ATS offers a wide variety of ultra-performance extruded heat sinks with high aspect ratio for applications where there is adequate airflow to take optimum advantage from these designs. Heat sink solutions are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm with 1mm increments. These heat sinks can be attached to the device with double-sided thermal adhesive, Z-clip or maxiGRIP™ technologies. Custom Pin Fin design offers an excellent cooling solution for spatially constrained PCB layouts when the direction of the airflow in the vicinity of the device is ambiguous. Custom Pin Fin Features & Benefits High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps cost low Comes standard without interface material, or with most common pressure sensitive thermal tapes as a custom option
Why ATS' Pin Fin? Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW Custom Pin Fin Applications ATS’ custom pin fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why ATS' Pin Fin? Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW
Custom Pin Fin Applications ATS’ custom pin fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx