eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin fanSINK™ Heat Sinks Low cost, high performance cooling for hot components fanSINK Dimensions Length (A) 27.0 - 84.0 mm Width (B) 27.0 - 84.0 mm Height (C) 9.5 - 24.5 mm Depth (D) N/A Natural airflow may not be sufficient for cooling BGAs and other hot components. This is often the case inside dense telecomm chassis, 1U and 2U servers, and blades. More cooling airflow is needed at the device level. Added airflow can be provided by fanSINK™ heat sinks from Advanced Thermal Solutions, Inc. (ATS). Depending on their size, fanSINK™ can be securely clipped onto a device with the ATS maxiGRIP™ attachment system, or by using standoff and spring hardware for direct attachment to the PCB. Smaller fanSINK™ attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. The fans for use with fanSINK™ are not provided. Fan types are specific to customer requirements and should be sourced independently. Features fanSINKs feature cross cut, straight fins that maximize fan airflow for more efficient cooling. Smaller size fanSINKs assemblies (27mm–45mm) are mounted onto hot components with the ATS maxiGRIP™ mechanical attachment system. maxiGRIP features a tight plastic frame clip and stainless steel spring clip. More on maxiGRIP. Larger size fanSINKs (53mm–84mm) fit tightly on components and attach firmly to the PCB with standoff and spring hardware. fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. The fans are securely attached to the heat sinks with stainless steel screws, ensuring reliable fan to heat sink assembly and performance. Please Note: FAN NOT INCLUDED. Fan type is specific to individual customer requirements. Fans need to be sourced independently. Features & Benefits The fanSINK cross cut, Straight Fin heat sink fins offer omni-directional air flow for optimum thermal performance in any PCB lay-out fanSINKs attached with ATS maxiGRIP™ use a high performance plastic frame clip and 300 series stainless steel spring clip. This avoids drilling holes in the PCB "Keep-Out" Requirements when using maxiGRIP: : An "Un-Populated" border zone of 5mm around the component is necessary to facilitate the Installation/Removal of the maxiGRIP™. Please refer to the maxiGRIP™ Clearance Guidelines and maxiGRIP™ Installation/Removal Guides for further details fanSINKs are pre-assembled with thermal interface material to optimize heat flow and cooling performance. Why fanSINK? Why maxiGRIP? Installation/Removal Guide Clearance Guidelines Related Qpedia Articles Design Services Videos Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us fanSINK™ with maxiGRIP™ Applications ATS’ fanSINK’s can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
fanSINK Dimensions Length (A) 27.0 - 84.0 mm Width (B) 27.0 - 84.0 mm Height (C) 9.5 - 24.5 mm Depth (D) N/A
Natural airflow may not be sufficient for cooling BGAs and other hot components. This is often the case inside dense telecomm chassis, 1U and 2U servers, and blades. More cooling airflow is needed at the device level. Added airflow can be provided by fanSINK™ heat sinks from Advanced Thermal Solutions, Inc. (ATS). Depending on their size, fanSINK™ can be securely clipped onto a device with the ATS maxiGRIP™ attachment system, or by using standoff and spring hardware for direct attachment to the PCB. Smaller fanSINK™ attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. The fans for use with fanSINK™ are not provided. Fan types are specific to customer requirements and should be sourced independently. Features fanSINKs feature cross cut, straight fins that maximize fan airflow for more efficient cooling. Smaller size fanSINKs assemblies (27mm–45mm) are mounted onto hot components with the ATS maxiGRIP™ mechanical attachment system. maxiGRIP features a tight plastic frame clip and stainless steel spring clip. More on maxiGRIP. Larger size fanSINKs (53mm–84mm) fit tightly on components and attach firmly to the PCB with standoff and spring hardware. fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. The fans are securely attached to the heat sinks with stainless steel screws, ensuring reliable fan to heat sink assembly and performance. Please Note: FAN NOT INCLUDED. Fan type is specific to individual customer requirements. Fans need to be sourced independently. Features & Benefits The fanSINK cross cut, Straight Fin heat sink fins offer omni-directional air flow for optimum thermal performance in any PCB lay-out fanSINKs attached with ATS maxiGRIP™ use a high performance plastic frame clip and 300 series stainless steel spring clip. This avoids drilling holes in the PCB "Keep-Out" Requirements when using maxiGRIP: : An "Un-Populated" border zone of 5mm around the component is necessary to facilitate the Installation/Removal of the maxiGRIP™. Please refer to the maxiGRIP™ Clearance Guidelines and maxiGRIP™ Installation/Removal Guides for further details fanSINKs are pre-assembled with thermal interface material to optimize heat flow and cooling performance.
Why fanSINK? Why maxiGRIP? Installation/Removal Guide Clearance Guidelines Related Qpedia Articles Design Services Videos Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us fanSINK™ with maxiGRIP™ Applications ATS’ fanSINK’s can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why fanSINK? Why maxiGRIP? Installation/Removal Guide Clearance Guidelines Related Qpedia Articles Design Services Videos Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us
fanSINK™ with maxiGRIP™ Applications ATS’ fanSINK’s can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx