eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOWâ„¢ Cross Cut fanSINKâ„¢ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIPâ„¢ superGRIPâ„¢ Push Pin maxiFLOW™ Heat Sinks w/ superGRIP™ Attachment Designed for standard height components from 3 to 4.5mm Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 7.5 - 17.5 mm Fin Tip to Fin Tip (D) 17.8 - 70.0 mm maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling and superGRIP™ offers the least amount of keep-out area required around a given BGA. maxiFLOW™ heat sink with the superGRIP™ attachment system are the ideal cooling solution for high-density PCBs, where the thermal requirements and board routing makes the use of other heat sink attachments difficult or impossible. maxiFLOW™ Features & Benefits Requires minimal space around the components perimeter; ideal for densely populated PCBs Allows the heat sink to be detached and reattached without damaging the component or te PCB, an important feature in the event a PCB may need to be reworked Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs Eliminates the need to drill mounting holes in the PCB Assembly comes standard with a high performance maxiFLOWTM heat sink, which maximizes convection (air) cooling. Please refer to the superGRIPTM Keep-Out Guidelines and superGRIPTM Installation/Removal Guide for further details Comes standard with clean break, reworkable, Chomerics T-766 phase change material Why maxiFLOW? Why superGRIP? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 7.5 - 17.5 mm Fin Tip to Fin Tip (D) 17.8 - 70.0 mm
maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling and superGRIP™ offers the least amount of keep-out area required around a given BGA. maxiFLOW™ heat sink with the superGRIP™ attachment system are the ideal cooling solution for high-density PCBs, where the thermal requirements and board routing makes the use of other heat sink attachments difficult or impossible. maxiFLOW™ Features & Benefits Requires minimal space around the components perimeter; ideal for densely populated PCBs Allows the heat sink to be detached and reattached without damaging the component or te PCB, an important feature in the event a PCB may need to be reworked Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs Eliminates the need to drill mounting holes in the PCB Assembly comes standard with a high performance maxiFLOWTM heat sink, which maximizes convection (air) cooling. Please refer to the superGRIPTM Keep-Out Guidelines and superGRIPTM Installation/Removal Guide for further details Comes standard with clean break, reworkable, Chomerics T-766 phase change material
Why maxiFLOW? Why superGRIP? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why maxiFLOW? Why superGRIP? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us
maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx