eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 24 48 96 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin maxiFLOW™ Heat Sinks w/ superGRIP™ Attachment Ideal For Densely Populated PCBs Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 7.5 - 17.5 mm Fin Tip to Fin Tip (D) 17.8 - 70.0 mm maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling and superGRIP™ offers the least amount of keep-out area required around a given BGA. maxiFLOW™ heat sink with the superGRIP™ attachment system are the ideal cooling solution for high-density PCBs, where the thermal requirements and board routing makes the use of other heat sink attachments difficult or impossible. maxiFLOW™ Features & Benefits Requires minimal space around the components perimeter; ideal for densely populated PCBs Allows the heat sink to be detached and reattached without damaging the component or te PCB, an important feature in the event a PCB may need to be reworked Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs Eliminates the need to drill mounting holes in the PCB Assembly comes standard with a high performance maxiFLOWTM heat sink, which maximizes convection (air) cooling. Please refer to the superGRIPTM Keep-Out Guidelines and superGRIPTM Installation/Removal Guide for further details Comes standard with clean break, reworkable, Chomerics T-766 phase change material Why maxiFLOW? Why superGRIP? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services maxiFLOW video Heat Sink Selection Tool BUY NOW maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 24 48 96 Products: All | eShop | By Distributor | By Quote 1 2 3 4 5 ImagePart NumberEquivalent Part#L (mm)W (mm)H (mm)Fin TipFlow Price 1K BuyData Sheet ATS-X50150B-C1-R0 » 15.0 15.0 7.5 27.9 UF: 19.7 DF: 14.6 Digi-Key » ATS-X50150G-C1-R0 » 15.0 15.0 12.5 N/A UF: N/A DF: N/A Digi-Key » ATS-X50150P-C1-R0 » 15.0 15.0 17.5 N/A UF: N/A DF: N/A Digi-Key » ATS-X50170B-C1-R0 » 17.0 17.0 7.5 28.4 UF: 18.2 DF: 13.9 Digi-Key » ATS-X50170G-C1-R0 » 17.0 17.0 12.5 31.9 UF: 11.1 DF: 9.0 Digi-Key » ATS-X50170P-C1-R0 » 17.0 17.0 17.5 31.9 UF: 8.3 DF: 6.8 Digi-Key » ATS-X50190B-C1-R0 » 19.0 19.0 7.5 31.5 UF: 16.5 DF: 12.9 Digi-Key » ATS-X50190G-C1-R0 » 19.0 19.0 12.5 34.8 UF: 10.2 DF: 8.4 Digi-Key » ATS-X50190P-C1-R0 » 19.0 19.0 17.5 34.7 UF: 7.7 DF: 6.4 Digi-Key » ATS-X50210B-C1-R0 » 21.0 21.0 7.5 34.6 UF: 11.9 DF: 8.8 Digi-Key » ATS-X50210G-C1-R0 » 21.0 21.0 12.5 38.2 UF: 7.2 DF: 5.7 Digi-Key » ATS-X50210P-C1-R0 » 21.0 21.0 17.5 38.2 UF: 5.4 DF: 4.3 Digi-Key » ATS-X50230B-C1-R0 » 23.0 23.0 7.5 37.5 UF: 10.9 DF: 8.3 Digi-Key » ATS-X50230G-C1-R0 » 23.0 23.0 12.5 41.5 UF: 6.7 DF: 5.4 Digi-Key » ATS-X50230P-C1-R0 » 23.0 23.0 17.5 41.5 UF: 5.1 DF: 4.1 Digi-Key » ATS-X50250B-C1-R0 » 25.0 25.0 7.5 36.4 UF: 8.6 DF: 6.1 Digi-Key » ATS-X50250G-C1-R0 » 25.0 25.0 12.5 44.9 UF: 5.2 DF: 4.0 Digi-Key » ATS-X50250P-C1-R0 » 25.0 25.0 17.5 44.9 UF: 3.9 DF: 3.0 Digi-Key » ATS-X50270B-C1-R0 » 27.0 27.0 7.5 43.2 UF: 7.9 DF: 5.8 Digi-Key » ATS-X50270G-C1-R0 » 27.0 27.0 12.5 48.3 UF: 4.8 DF: 3.8 Digi-Key » ATS-X50270P-C1-R0 » 27.0 27.0 17.5 48.4 UF: 3.7 DF: 2.9 Digi-Key » ATS-X50290B-C1-R0 » 29.0 29.0 7.5 42.4 UF: 7.4 DF: 5.6 Digi-Key » ATS-X50290G-C1-R0 » 29.0 29.0 12.5 51.7 UF: 4.5 DF: 3.7 Digi-Key » ATS-X50290P-C1-R0 » 29.0 29.0 17.5 51.7 UF: 3.5 DF: 2.8 Digi-Key » Top ↑ 1 2 3 4 5 *Fin: Tip to Fin Tip *UF: Unducted Flow DF: Ducted Flow
Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 7.5 - 17.5 mm Fin Tip to Fin Tip (D) 17.8 - 70.0 mm
maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling and superGRIP™ offers the least amount of keep-out area required around a given BGA. maxiFLOW™ heat sink with the superGRIP™ attachment system are the ideal cooling solution for high-density PCBs, where the thermal requirements and board routing makes the use of other heat sink attachments difficult or impossible. maxiFLOW™ Features & Benefits Requires minimal space around the components perimeter; ideal for densely populated PCBs Allows the heat sink to be detached and reattached without damaging the component or te PCB, an important feature in the event a PCB may need to be reworked Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs Eliminates the need to drill mounting holes in the PCB Assembly comes standard with a high performance maxiFLOWTM heat sink, which maximizes convection (air) cooling. Please refer to the superGRIPTM Keep-Out Guidelines and superGRIPTM Installation/Removal Guide for further details Comes standard with clean break, reworkable, Chomerics T-766 phase change material
Why maxiFLOW? Why superGRIP? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services maxiFLOW video Heat Sink Selection Tool BUY NOW maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why maxiFLOW? Why superGRIP? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services maxiFLOW video Heat Sink Selection Tool BUY NOW
maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx