Dimensions
Length (A) 15.0 - 45.0 mm
Width (B) 15.0 - 45.0 mm
Height (C) 7.5 - 17.5 mm
Fin Tip to Fin Tip (D) 17.8 - 70.0 mm
maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling and
superGRIP™ offers the least amount of keep-out area required around a given BGA.
maxiFLOW™ heat sink with the
superGRIP™ attachment system are the ideal cooling solution for high-density PCBs, where the thermal requirements and board routing makes the use of other heat sink attachments difficult or impossible.
maxiFLOW™ Features & Benefits
- Requires minimal space around the components perimeter; ideal for densely populated PCBs
- Allows the heat sink to be detached and reattached without damaging the component or te PCB, an important feature in the event a PCB may need to be reworked
- Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs
- Eliminates the need to drill mounting holes in the PCB
- Assembly comes standard with a high performance maxiFLOWTM heat sink, which maximizes convection (air) cooling. Please refer to the superGRIPTM Keep-Out Guidelines and superGRIPTM Installation/Removal Guide for further details
- Comes standard with clean break, reworkable, Chomerics T-766 phase change material
Product and How To Videos