Dimensions
Length (A) 15.0 - 58.0 mm
Width (B) 15.0 - 57.5 mm
Height (C) 4.0 - 16.0 mm
Fin Tip to Fin Tip (D) 17.8 - 70.0 mm
ASIC packaging can come in the form or FPGA, BGA or LGA – these are custom designed electronics engines in some special packaging that require a unique and high capacity cooling. ATS offers over 4000 cooling solutions with the highest thermal performance to cool the most common ASIC devices on the market.
ASIC Cooling Features & Benefits
- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- Designed specifically for ASIC packages and their unique cooling requirements
- Comes pre-assembled with high performance thermal interface material.
- Over 4,000 off-the-shelf or customized ASIC solutions
- A wide variety of shapes and sizes, including ATS' patented maxiFLOW™ flared fin technology, support various ASIC configurations
Product and How To Videos