- Designed for vision AI applications, robotics and industrial applicationss
- Pre-Built Hardware Acceleration
- Adaptable to changing software and hardware. Ruggedized for industrial life cycles
- Developers are able to program and differentiate their designs at the software level, without requiring FPGA programming experience.
- Designed and purpose built to fit the NVIDIA Jetson Family of modules
- Passive and active solutions available
- Straight-fin, black anodized, aluminum heat sinks
- A fan attachment hardware kit is provided for heat sinks that will use fans. The fans are not included and should be chosen to match performance needs.
- Designed for flip-chip processors such as NXP MPCs
- maxiGRIP™attachment applies steady, even pressure to the component and does not require holes in the PCB
- Comes preassembled with high performance, phase changing, thermal interface material
- Designed specifically for TI’s Audio Evaluation Modules
- Heat sinks come with 2 4-40 taped threaded holes
- Optimized for natural convection air cooling
- Black anodized for maximum heat dissipation
- Designed for the ADI reference designs AD9166,AD9986/8, AD9081/2, and the quad-mxFE
- Component Attachment: ATS superGRIP™ is a proven high reliability mechanical attachment system
- Provided with pre-assembled Thermal Interface Material (TIM) centered on based
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