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Device Specific Heat Sinks


Industrial LED Heat Sinks and Cooling Solutions
  • Designed for flip-chip processors such as NXP MPCs
  • maxiGRIP™attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Comes preassembled with high performance, phase changing, thermal interface material

Commercial LED Heat Sinks and Cooling Solutions
  • Designed specifically for TI’s Audio Evaluation Modules
  • Heat sinks come with 2 4-40 taped threaded holes
  • Optimized for natural convection air cooling
  • Black anodized for maximum heat dissipation