eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 96 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin Device Specific Heat Sinks High Performance Device Specific - NXP Designed for flip-chip processors such as NXP MPCs maxiGRIP™attachment applies steady, even pressure to the component and does not require holes in the PCB Comes preassembled with high performance, phase changing, thermal interface material High Performance Device Specific - Texas Instruments Designed specifically for TI’s Audio Evaluation Modules Heat sinks come with 2 4-40 taped threaded holes Optimized for natural convection air cooling Black anodized for maximum heat dissipation High Performance Device Specific - Analog Devices Designed for the ADI reference designs AD9166,AD9986/8, AD9081/2, and the quad-mxFE Component Attachment: ATS superGRIP™ is a proven high reliability mechanical attachment system Provided with pre-assembled Thermal Interface Material (TIM) centered on based