eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 96 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin Heat Sinks For Texas Instruments ATS heat sink family are optimized for natural convection air cooling Dimensions Length (A) 50.0 -78.0 mm Width (B) 13.0 - 36.0 mm Height (C) 2.0 - 35.6 mm Texas Instruments Incorporated designs and manufactures analog technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is a leader in semiconductor solutions for analog and digital embedded and applications processing and sought out ATS’ innovative heat sink technology to design a solution specific for TI’s Audio Evaluation Modules. ATS’ heat sinks are optimized for natural convection air cooling. This black anodized finish allows for maximum heat dissipation TI Heat Sink Features & Benefits Designed specifically for TI’s Audio Evaluation Modules Heat sinks come with 2 4-40 taped threaded holes Optimized for natural convection air cooling Black anodized for maximum heat dissipation Why ATS' Device Specific Heat Sinks? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW
Texas Instruments Incorporated designs and manufactures analog technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is a leader in semiconductor solutions for analog and digital embedded and applications processing and sought out ATS’ innovative heat sink technology to design a solution specific for TI’s Audio Evaluation Modules. ATS’ heat sinks are optimized for natural convection air cooling. This black anodized finish allows for maximum heat dissipation TI Heat Sink Features & Benefits Designed specifically for TI’s Audio Evaluation Modules Heat sinks come with 2 4-40 taped threaded holes Optimized for natural convection air cooling Black anodized for maximum heat dissipation
Why ATS' Device Specific Heat Sinks? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW
Why ATS' Device Specific Heat Sinks? Installation/Removal Guide Clearance Guidelines Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW