NVIDIA Jetson modules are widely used in edge AI systems, robotics, machine vision, autonomous machines, smart manufacturing, medical devices, defense electronics, and industrial embedded computing. As Jetson processors deliver higher AI performance in compact form factors, effective thermal management becomes critical to system reliability, processing stability, and long-term performance.
ATS heat sinks are available for both natural convection and forced-air cooling designs. Engineers can select compact passive heat sinks for space-constrained or low-airflow applications, or active/fan-ready heat sinks when additional airflow is required to manage higher power densities.
NVIDIA Jetson Heat Sink Features
ATS device-specific NVIDIA Jetson heat sinks are designed to simplify integration into embedded AI and industrial electronics platforms.
ATS provides heat sinks and thermal transfer plates designed to fit popular NVIDIA®Jetson™modules, including:
- Jetson AGX Orin™ and AGX Xavier™
- Jetson Orin™ NX
- Jetson Orin™ Nano and Orin™ Nano Super Mode
- Jetson Xavier™ NX
- Jetson TX2 NX
- Jetson Nano™
- Jetson Thor™
Key features include:
- Designed to fit NVIDIA Jetson module mechanical layouts
- Passive, active, and fan-ready heat sink options
- Aluminum heat sink construction
- Anodized finish for enhanced thermal performance and durability
- Pre-assembled thermal interface material on the heat sink base
- Secure PCB mounting using screws or steel leaf spring hardware
- Fan attachment hardware kit included on fan-ready models
- Thermal transfer plates available for Jetson modules requiring chassis or system-level thermal integration
- Suitable for robotics, edge AI, computer vision, autonomous systems, industrial automation, and rugged embedded applications
How to Choose the Right NVIDIA Jetson Heat Sink
Selecting the correct NVIDIA Jetson cooling solution depends on the module, power level, available airflow, system enclosure, ambient temperature, and mounting requirements.
Use a passive heat sink when:
- The system has available natural convection or enclosure-level airflow
- Low noise or fanless operation is required
- The design is space constrained
- Reliability requirements favor fewer moving parts
Use an active or fan-ready heat sink when:
- The Jetson module operates at higher power levels
- The system runs AI workloads for extended periods
- Airflow is available or a fan can be added
- The design requires lower thermal resistance
Use a thermal transfer plate when:
- The Jetson module does not include an integrated thermal plate
- Heat must be conducted into a chassis, enclosure, or secondary heat sink
- The system requires custom thermal integration