eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 96 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin LGA Heat Sinks Standard flip-chip Ball Grid Array (BGA) Dimensions Length (A) 56.0 - 94.0 mm Width (B) 56.0 - 101.0 mm Height (C) 27.0 - 52.0 mm An LGA (Land Grid Array) package is a standard flip-chip Ball Grid Array (BGA) shipped with no spheres. LGA packages have been available for hand-held devices telecomm and datacomm applications. Freescale (Quad-Core i.MX), Linear Technology (LTM4600), AMD (Quad FX platform), STMicroelectronics (LIS331Dlx), Intel (Core i7 920, Core i7 965), and other manufacturer devices that are compatible with LGA heat sinks. The ATS-57000 series of LGA heat sinks, from ATS, provides the highest level of cooling performance for LGA applications for Intel and AMD multicore processors. LGA Heat Sink Features & Benefits Designed for high-power LGA applications such as Freescale and Intel processors Active and passive cooling solutions available Thermal resistance of 0.51°C/W or lower with custom design Continuous air flow is provided by a Sayno Denki DC fan (included) Unique attachment minimizes mechanical stress on the device Includes spring-loaded, push pin mounts for direct attachment to the PCB Why ATS' LGA Heat Sinks? Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW LGA Heat Sink Applications ATS’ LGA heat sinks can be used for component, such as: Altera AMD Freescale Intel TI
An LGA (Land Grid Array) package is a standard flip-chip Ball Grid Array (BGA) shipped with no spheres. LGA packages have been available for hand-held devices telecomm and datacomm applications. Freescale (Quad-Core i.MX), Linear Technology (LTM4600), AMD (Quad FX platform), STMicroelectronics (LIS331Dlx), Intel (Core i7 920, Core i7 965), and other manufacturer devices that are compatible with LGA heat sinks. The ATS-57000 series of LGA heat sinks, from ATS, provides the highest level of cooling performance for LGA applications for Intel and AMD multicore processors. LGA Heat Sink Features & Benefits Designed for high-power LGA applications such as Freescale and Intel processors Active and passive cooling solutions available Thermal resistance of 0.51°C/W or lower with custom design Continuous air flow is provided by a Sayno Denki DC fan (included) Unique attachment minimizes mechanical stress on the device Includes spring-loaded, push pin mounts for direct attachment to the PCB
Why ATS' LGA Heat Sinks? Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW LGA Heat Sink Applications ATS’ LGA heat sinks can be used for component, such as: Altera AMD Freescale Intel TI
Why ATS' LGA Heat Sinks? Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW
LGA Heat Sink Applications ATS’ LGA heat sinks can be used for component, such as: Altera AMD Freescale Intel TI