eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin Pin Fin Heat Sinks More efficient heat sink with higher performance per gram Dimensions Length (A) 21.0 - 53.3 mm Width (B) 21.0 - 53.3 mm Height (C) 3.8 - 25.4 mm Fin Tip to Fin Tip (D) 21.0 - 53.3 mm Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape. Pin Fin Features & Benefits High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps cost low Comes standard without interface material, or with most common pressure sensitive thermal tapes as a custom option Why ATS' Pin Fin? Related Products Related Qpedia Articles Design Services Videos BUY NOW Pin Fin Applications ATS’ pin fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Dimensions Length (A) 21.0 - 53.3 mm Width (B) 21.0 - 53.3 mm Height (C) 3.8 - 25.4 mm Fin Tip to Fin Tip (D) 21.0 - 53.3 mm
Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape. Pin Fin Features & Benefits High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps cost low Comes standard without interface material, or with most common pressure sensitive thermal tapes as a custom option
Why ATS' Pin Fin? Related Products Related Qpedia Articles Design Services Videos BUY NOW Pin Fin Applications ATS’ pin fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Pin Fin Applications ATS’ pin fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx