eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 96 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOWâ„¢ Cross Cut fanSINKâ„¢ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIPâ„¢ superGRIPâ„¢ Push Pin Straight Fin Heat Sinks High aspect ratio heat sinks ensure reliable product life at a lower cost Dimensions Length (A) 10.0 - 60.0 mm Width (B) 10.0 - 60.0 mm Height (C) 2.0 - 25.0 mm Fin Tip to Fin Tip (D) 10.0 - 60.0 mm ATS offers a wide variety of ultra-performance extruded heat sinks with high aspect ratio for applications where there is adequate airflow to take optimum advantage from these designs. Straight fin heat sink solutions are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm with 1mm increments. These heat sinks can be attached to the device with double-sided thermal adhesive, Z-clip or maxiGRIP™ technologies The Straight Fin design offers an excellent cooling solution for spatially constrained PCB layouts. Straight Fin Features & Benefits High aspect ratio, straight fin heat sinks are ideal for compact PCB environments Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks Extruded aluminum minimizes thermal resistance, reduces weight and keeps costs low Comes standard without interface material or with most common pressure sensitive thermal tapes as a custom option Why ATS' Straight Fin? Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW Straigh Fin Applications ATS’ straight fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Dimensions Length (A) 10.0 - 60.0 mm Width (B) 10.0 - 60.0 mm Height (C) 2.0 - 25.0 mm Fin Tip to Fin Tip (D) 10.0 - 60.0 mm
ATS offers a wide variety of ultra-performance extruded heat sinks with high aspect ratio for applications where there is adequate airflow to take optimum advantage from these designs. Straight fin heat sink solutions are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm with 1mm increments. These heat sinks can be attached to the device with double-sided thermal adhesive, Z-clip or maxiGRIP™ technologies The Straight Fin design offers an excellent cooling solution for spatially constrained PCB layouts. Straight Fin Features & Benefits High aspect ratio, straight fin heat sinks are ideal for compact PCB environments Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks Extruded aluminum minimizes thermal resistance, reduces weight and keeps costs low Comes standard without interface material or with most common pressure sensitive thermal tapes as a custom option
Why ATS' Straight Fin? Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW Straigh Fin Applications ATS’ straight fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why ATS' Straight Fin? Related Products Related Qpedia Articles Design Services Videos Heat Sink Selection Tool BUY NOW
Straigh Fin Applications ATS’ straight fin heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx