eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin blueICE™ Ultra Low Profile Heat Sinks Designed for High Performance in Low Air Velocities Dimensions Length (A) 10.0 - 60.0 mm Width (B) 10.0 - 60.0 mm Height (C) 2.0 - 25.0 mm Fin Tip to Fin Tip (D) 10.0 - 60.0 mm In many electronics systems, such as Telecomm, Datacomm, Biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. Electronics packages such as BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, LQFP are commonly used with stringent thermal requirements in a tight space with limited airflow. Ultra low profile heat sinks offered by ATS range from 2 to 7mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. Their thermal resistance is as low as 1.23° C/W within an air velocity of 600 ft/min. blueICE™ heat sinks are very lightweight, ranging from 4 to 30 grams. No mechanical hardware is needed to mount them to components. A double-sided, thermal conductive adhesive tape can be used to attach a blueICE heat sink securely. This feature reduces weight and assembly time, while saving valuable board space. blueICE™ Ultra Low Profile Features & Benefits blueICE™ heat sinks feature an ultra low profile for tough-to-cool applications Designed for high performance in low air velocities Ideal for telecommunications applications where space is limited Comes pre-assembled with high performance thermal interface material Why blueICE? Related Products Related Qpedia Articles Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us Ultra Low Heat Sink Applications ATS’ blueICE™, ultra low profile heat sinks, can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Dimensions Length (A) 10.0 - 60.0 mm Width (B) 10.0 - 60.0 mm Height (C) 2.0 - 25.0 mm Fin Tip to Fin Tip (D) 10.0 - 60.0 mm
In many electronics systems, such as Telecomm, Datacomm, Biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. Electronics packages such as BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, LQFP are commonly used with stringent thermal requirements in a tight space with limited airflow. Ultra low profile heat sinks offered by ATS range from 2 to 7mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. Their thermal resistance is as low as 1.23° C/W within an air velocity of 600 ft/min. blueICE™ heat sinks are very lightweight, ranging from 4 to 30 grams. No mechanical hardware is needed to mount them to components. A double-sided, thermal conductive adhesive tape can be used to attach a blueICE heat sink securely. This feature reduces weight and assembly time, while saving valuable board space. blueICE™ Ultra Low Profile Features & Benefits blueICE™ heat sinks feature an ultra low profile for tough-to-cool applications Designed for high performance in low air velocities Ideal for telecommunications applications where space is limited Comes pre-assembled with high performance thermal interface material
Why blueICE? Related Products Related Qpedia Articles Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us Ultra Low Heat Sink Applications ATS’ blueICE™, ultra low profile heat sinks, can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why blueICE? Related Products Related Qpedia Articles Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us
Ultra Low Heat Sink Applications ATS’ blueICE™, ultra low profile heat sinks, can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx