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ATS PCB backing-plate is available for applications other than socket LGA Socket 2011 and LGA Socket 2066 (FPGA, GPU, etc.). Part number ATS-HK379-R0.
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Mechanical Information

Ultra-Cool Active and Passive Solutions for High Powered Devices


quadFLOW™ with airflow direction

Fanless High Performance Cooler

dualFLOW™ with airflow direction

Fanless High Performance Cooler

ATS has designed a family of ultra-high-performance active and passive coolers for high-powered processors, such as CPUs, FPGAs, and GPUs. dualFLOW™ and quadFLOW™ use a blower to provide additional airflow at the device level. dualFLOW™ pulls air in from two sides, while quadFLOW™ has a unique design that enables air to be pulled across the device from four sides, providing higher thermal performance than other fan-ready heat sinks on the market. These are perfect for systems with constrained airflow..

ATS also has heat sinks that take advantage of system airflow to provide cooling of high-powered devices, available in blue anodized aluminum or nickel-plated copper depending on the thermal and weight restrictions of your project.

The following table details the full family of Ultra-Cool, High-Performance Coolers. Scroll down for more information about the active or passive solutions that ATS has to offer..

ATS High-Performance Active and Passive Solutions for High-Powered Device
Dimensions (mm) : QFLOW and DFLOW heat sinks 92.38 (L) X 92.11(W) X 29(H) | Fanless heat sinks 90 L X 90 W X 28 H
Thermal Resistance data are for 40 X 40 mm Component | For QFLOW and DFLOW 100% duty cycle of the blower
ImagePart NumberR (°C/W)Max TDP (W)Application NotesBuyRoHS & Data Sheet
ATS-UC-DFLOW-100 » 0.20 160 For less-resticted PCB layouts,aluminium fins reduce weight and air enters the heat sink from two directions Check
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ATS-UC-DFLOW-200 » 0.19 170 For less-dense PCB layouts, copper fns improve heat spreading and air enters heat sink from two directions. Check
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ATS-UC-DFLOW-VC-200 » 0.20 160 For less-dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from two directions Check
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ATS-UC-NF-100 » 0.33 97 Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight Check
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ATS-UC-NF-101 » 0.31 105 Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight Check
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ATS-UC-NF-200 » 0.21 150 Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight Check
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ATS-UC-NF-201 » 0.17 190 Ideal for 1U systems with open airflow front to back, copper fins reduce spreading resistance Check
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ATS-UC-QFLOW-100 » 0.21 152 For PCB layouts with restricted airflow, aluminum fins reduce, weight and air enters the heat sink from four directions Check
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ATS-UC-QFLOW-200 » 0.20 160 For dense PCB layouts, copper fins improve heat spreading and air enters heat sink from four directions Check
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ATS-UC-QFLOW-VC-200 » 0.20 160 For dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from four directions Check
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High-Performance Active Coolers


quadFLOW™ with airflow direction

dualFLOW™ with airflow direction

dualFLOW™ and quadFLOW™ active coolers are designed for dense systems using high-powered processors, including CPUs, FPGAs, or GPUs. Both products include a straight fin heat sink base with a high-performance blower, which pulls air across the device to maximize cooling. dualFLOW™ pulls air from two directions, while quadFLOW™ pulls air from four directions to maximize thermal performance even in dense systems where airflow is limited, and conventional cooling solutions are ineffective.

dualFLOW™ and quadFLOW™ provide at least 20% improvement in thermal performance compared to other CPU coolers on the market. Both products fit standard Intel™ LGA2011 square or LGA2066 sockets, also known as Socket R. Customers can choose between aluminum or copper fins or a version with vapor chamber base, depending on the required thermal performance or weight restrictions.

Features and Benefits

  • Ideal for 1U and 2U applications where space and airflow are restricted
  • Designed for CPUs that fit the Intel™ LGA2011 square and LGA2066 sockets (Socket R)
  • Mechanical attachment is PEM, screws and spring – for other types of attachments contact ATS
  • Provided with Chomerics T670 thermal grease
  • Hardware provides 9.2 PSI (63 kPa) when installed
  • PWM enabled blower: 10.8 VDC ~ 13.2 VDC operating voltage
  • Provides at least 20% improvement over comparable products on the market
  • To apply this heat sink to other high power devices and processors contact ATS
  • Patent Pending

ATS High-Performance dualFLOW and quadFLOW High-Powered Device
Dimensions (mm) : 92.38 (L) X 92.11(W) X 29(H)
ImagePart NumberFin MaterialWeight (g)R (°C/W)Max TDP (W)Application NotesBuyRoHS & Data Sheet
ATS-UC-DFLOW-100 » Al 436 0.20 160 For less-resticted PCB layouts,aluminium fins reduce weight and air enters the heat sink from two directions Check
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ATS-UC-DFLOW-200 » Cu 566 0.19 170 For less-dense PCB layouts, copper fns improve heat spreading and air enters heat sink from two directions. Check
Distribution
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ATS-UC-DFLOW-VC-200 » Cu 479 0.20 160 For less-dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from two directions Check
Distribution
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ATS-UC-QFLOW-100 » AL 456 0.21 152 For PCB layouts with restricted airflow, aluminum fins reduce, weight and air enters the heat sink from four directions Check
Distribution
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ATS-UC-QFLOW-200 » Cu 580 0.20 160 For dense PCB layouts, copper fins improve heat spreading and air enters heat sink from four directions Check
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ATS-UC-QFLOW-VC-200 » Cu 493 0.20 160 For dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from four directions Check
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Thermal Resistance date are for 40 X 40 mm component and 100% duty cycle of the blower.


Ultra-Cool Passive Coolers

Fanless High Performance Cooler

ATS high-performance passive coolers are designed to take advantage of system airflow to cool high-powered processors, including CPUs, GPUs, and FPGAs, that fit the Intel™ LGA2011 square or LGA2066 sockets (also known as Socket R). The passive coolers are straight-fin heat sinks with mechanical attachment hardware. They come in blue anodized aluminum or nickel-plated copper depending on thermal performance and weight requirements.

The passive coolers are ideal for systems with open airflow from front to back. Aluminum fins reduce the overall weight, while copper fins reduce spreading resistance for better thermal performance. An optional backing plate is available for applications other than the LGA2011 square socket. The backing plate attaches beneath the PCB to avoid damaging the board when attaching the cooler.

Features and Benefits

  • Provided with Chomerics T670 thermal grease
  • Mechanical attachment is PEM, screws and spring; For other types of attachments contact ATS
  • Installed hardware provides up to 9.2 PSI pressure
  • To apply these heat sinks to other high-powered processors, such as FPGAs, CPUs, AI processors, or GPUs, contact ATS

ATS High-Performance Passive Cooler Family
Dimensions (mm) : 90 (L) X 90 (W) X 28(H)
ImagePart NumberFin MaterialWeight (g)Max TDP (W)FinishBuyRoHS & Data Sheet
ATS-UC-NF-100 » AL 190 97 Blue Anodized Check
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ATS-UC-NF-101 » AL 242 105 Blue Anodized Check
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ATS-UC-NF-200 » Cu 728 150 Nickel Plated Check
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ATS-UC-NF-201 » Cu 808 190 Nickel Plated Check
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Thermal resistance and max TDP with airflow of 3 m/s except for ATS-UC-NF-201 where airflow is 4 m/s.
A 40 X 40 mm component was used for testing and the duty cycle of the blower is 100%