eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin maxiFLOW™ Heat Sinks Maximizes the Effective Convection (Air) Cooling Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 7.5 - 17.5 mm Fin Tip to Fin Tip (D) 15.0 - 45.0 mm maxiFLOW™ heat sink design provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP. Whenever higher cooling capacity is required, maxiFLOW™ with thermal tape can readily be used. The double sided adhesive thermal tape facilitates the attachment of the heat sink to the device. maxiFLOW™ Features & Benefits maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling Provides 20% higher thermal performance than alternative straight fin and pin fin heat sinks Provided with pre-assembled Chomerics T412 double-sided adhesive Custom options available. maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx Using a Clip for Attaching? Click to ATS’ solutions: maxiGRIP™ Heat Sink Attachment superGRIP™ Heat Sink Attachment
Dimensions Length (A) 15.0 - 45.0 mm Width (B) 15.0 - 45.0 mm Height (C) 7.5 - 17.5 mm Fin Tip to Fin Tip (D) 15.0 - 45.0 mm
maxiFLOW™ heat sink design provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP. Whenever higher cooling capacity is required, maxiFLOW™ with thermal tape can readily be used. The double sided adhesive thermal tape facilitates the attachment of the heat sink to the device. maxiFLOW™ Features & Benefits maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling Provides 20% higher thermal performance than alternative straight fin and pin fin heat sinks Provided with pre-assembled Chomerics T412 double-sided adhesive Custom options available.
maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx Using a Clip for Attaching? Click to ATS’ solutions: maxiGRIP™ Heat Sink Attachment superGRIP™ Heat Sink Attachment
maxiFLOW™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx Using a Clip for Attaching? Click to ATS’ solutions: maxiGRIP™ Heat Sink Attachment superGRIP™ Heat Sink Attachment