eShop Heat Sinks BGA - High Performance LGA Heat Sinks BGA - High Aspect Ratio LED Cooling Extrusion Profiles HS Types maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment maxiGRIP™ superGRIP™ Push Pin {1} ##LOC[OK]## {1} ##LOC[OK]## ##LOC[Cancel]## {1} ##LOC[OK]## ##LOC[Cancel]##
Group by: Heat Sinks Wind Tunnels Instruments Sensors Qpedia Sort by: Title A-Z Title Z-A Length Width Height Unducted Flow Ducted Flow Fin Spacing Results per page: 9000 48 24 Products: All | eShop | By Distributor | By Quote Title or Part# Advanced Search Dimensions L (mm) W (mm) H (mm) Thermal Resistance (°C/W) Unducted Ducted Component Specific All Freescale Xilinx Altera Agere Cavium Intel HS Type All maxiFLOW™ Cross Cut fanSINK™ Pin Fin Custom Pin Fin Slant Fin Stamp Straight Fin Power Brick HS By Attachment All maxiGRIP™ superGRIP™ Push Pin maxiFLOW™ Heat Sink w/ maxiGRIP™ Attachment Designed for Standard Height Components From 3 to 4.5mm Dimensions Length (A) 17.0 - 45.0 mm Width (B) 17.0 - 45.0 mm Height (C) 7.5 - 17.5 mm maxiFLOW™ heat sinks with maxiGRIP™ attachment offers the best performing heat sink with ease of attachment to the BGA package. BGA packages, due to RoHS requirements, come in different heights. ATS offers the largest selection heat sinks with state-of-the-art attachments for standard component heights between 3mm to 4.5mm. Because of the dense PCB routing, holes on the board are not readily available, making maxiFLOW™ with maxiGRIP™ attachment ideally suited for such applications. maxiFLOW™ w/ maxiGRIP™ Features & Benefits maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes to be drilled in the PCB Meets Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes pre-assembled with high performance, phase change, thermal interface material Designed for standard height components, from 3 to 4.5mm "Keep-Out" Requirements: An "Un-Populated" border zone of 5mm around the component is necessary to facilitate the Installation/Removal of the maxiGRIP™. Please refer to the maxiGRIP™ Clearance Guidelines and maxiGRIP™ Installation/Removal Guide for further details. Why maxiFLOW? Why maxiGRIP? Installation/Removal Guide Clearance Guidelines Related Qpedia Articles Related Products Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us maxiFLOW™ w/ maxiGRIP™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
maxiFLOW™ heat sinks with maxiGRIP™ attachment offers the best performing heat sink with ease of attachment to the BGA package. BGA packages, due to RoHS requirements, come in different heights. ATS offers the largest selection heat sinks with state-of-the-art attachments for standard component heights between 3mm to 4.5mm. Because of the dense PCB routing, holes on the board are not readily available, making maxiFLOW™ with maxiGRIP™ attachment ideally suited for such applications. maxiFLOW™ w/ maxiGRIP™ Features & Benefits maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes to be drilled in the PCB Meets Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes pre-assembled with high performance, phase change, thermal interface material Designed for standard height components, from 3 to 4.5mm "Keep-Out" Requirements: An "Un-Populated" border zone of 5mm around the component is necessary to facilitate the Installation/Removal of the maxiGRIP™. Please refer to the maxiGRIP™ Clearance Guidelines and maxiGRIP™ Installation/Removal Guide for further details.
Why maxiFLOW? Why maxiGRIP? Installation/Removal Guide Clearance Guidelines Related Qpedia Articles Related Products Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us maxiFLOW™ w/ maxiGRIP™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx
Why maxiFLOW? Why maxiGRIP? Installation/Removal Guide Clearance Guidelines Related Qpedia Articles Related Products Design Services maxiFLOW video Check Stock & Buy Now Custom Designs Available! Click Here to Contact Us
maxiFLOW™ w/ maxiGRIP™ Applications ATS’ maxiFLOW™ heat sinks can be applied to a wide variety of components, including: Altera AMD Freescale Intel TI Xilinx