Thermal Management Webinars 
Advanced Thermal Solutions, Inc. (ATS) presents a variety educational seminars including thermal management webinars for all engineers, designers and program managers with an interest in electronics cooling. The online tutorials provide practical information on critical areas of thermal management to help optimize individual cooling solutions.
Each of the approximately one-hour tutorials will includes detailed visuals and real time narration by an ATS thermal management expert. Viewers are able to key in questions during and after the presentations.
“ATS’ Thermal Management Webinar Series tutorials are an ideal forum for engineers, designers and program managers to advance their knowledge of electronics cooling,” said Kaveh Azar, president and CEO of Advanced Thermal Solutions, Inc., the sponsor of the online web seminar series. “Well suited for electrical, mechanical, photonics or network server engineers or DSP designers, ATS’ online training programs will provide attendees with practical, focused, technical information enabling them to identify optimal solutions for electronics cooling.”
Each webinar focuses on a different topic in the critical arena of electronics thermal management.
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Upcoming Webinars
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Understanding and Selecting Market Available Electronics Cooling Options
The market is saturated with varied cooling options for thermal management of electronic systems. Oftentimes, selecting the right cooling solution is a daunting task for engineers who are not actively involved in thermal management. In this webinar, cooling options and their salient features are reviewed, providing the practicing engineer with a strong overview of what has been done and what the limitations of such options are.
January 28, 2010 at 2:00 p.m. (EST):
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Thermal Management of Consumer Electronics
Consumer products are increasingly being deployed as flexible entertainment and productivity platforms using ever more sophisticated processors, DSP’s and FPGA. The sophistication of these technologies allows for a wide range of new features but can carry the burden of higher thermal management needs. Attendees will learn about the various options open to them including the importance of spreading resistance in component and system thermal management
February 11, 2010 at 2:00 p.m. (EST)
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How to Perform and Understand Temperature Measurement within Electronic Systems
Attendees will become familiar with the importance of temperature measurement in electronic systems, the instruments that are necessary and the location within a systems where testing should be conducted. Further, salient features of each measurement system and technique will be highlighted, and the most ideal sensors and their placement for accurate temperature measurement will be presented.
March 4, 2010 at 2:00 p.m. (EST)
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Air Velocity Measurement within Electronics Systems
Participants will be introduced to different sensors and their salient features. Sensors and measurement systems suitable for obtaining fluid velocity in electronic systems will be reviewed. Further, the importance of measuring air velocity in a system, the instruments necessary for obtaining useful data and where these velocities should be recorded will be highlighted and discussed in detail in this Webinar.
March 25, 2010 at 2:00 p.m. (EST)
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Strategies in Cooling High Capacity/High End Systems
As the definition of what a high capacity/high end system is changes to accommodate the ever increasing needs for computer and storage resources, so do the thermal management challenges. Attendees of this webinar will learn about the strategies for cooling high capacity systems, including the use of liquid cooling.
April 8, 2010 at 2:00 p.m. (EST)
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Heat Sink Selection Made Easy
As heat dissipation needs for electronic devices grow rapidly, choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods and how to solve design challenges thermally and mechanically; and how to make the right custom or off-the-shelf heat sink choice for your application and budget.
April 22, 2010 at 2:00 p.m. (EST)
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Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis
ATCA and MicroTCA are chassis standards geared to getting systems from telecomm, computing, military, medical and other companies to market faster and with lower cost. While the form factor, modularity and price point are attractive, thermal challenges can be magnified with the small form factors and interoperability challenges of a standard architecture. Attendees will be equipped with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.
May 27, 2010 at 2:00 p.m. (EST)
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Thermal Management in Medical Diagnostic Equipment
Thermal challenges in medical diagnostic equipment such as EKG machines, defibrillators, telemetry, ultrasound and other products present both similar challenges to other electronics as well as their unique set of needs due to their importance in people’s lives. This vertical webinar will focus on the specific needs that medical diagnostic equipment requires.
June 11, 2010 at 2:00PM (EST)
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CFD as a Tool to Perform Heat Sink and System Modeling
Computational Fluid Dynamics (CFD) tools have become simulation workhorses, enabling design engineers to tackle electronics cooling challenges on-the-fly. Some tips and tricks are invaluable in performing these analyses. Among them: the simplest methods of preparing a CFD model; the best techniques for meshing; and how to model a system’s components, such as fans and perforated plates. Attendees will learn about common and not-so-common issues in CFD, and how to overcome them.
June 24, 2010 at 2:00 p.m. (EST)
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Methodologies for Fan Characterization and Deployment within a System
Exponential increases in power dissipation are forcing engineers to rely more on fans as the solution to their thermal challenges. But fans are also common points of failure within a system. As the choice and use of fans become critical to system functionality, knowledge of fan characterization is essential. Participants will be provided with solid methodologies for characterizing fans and deploying them within a system.
July 22, 2010 at 2:00 p.m. (EST)
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Thermal Management of a Data Center
Datacenters are effectively large scale systems composed of the “components” of racks of computers. Novel approaches to cooling datacenters of various sizes are being undertaken today to obtain the best and most green cooling possible. This vertical webinar will consider approaches for small, medium and large scale datacenters to achieve a given datacenters cooling goals.
August 12, 2010 at 2:00PM (EST)
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Selecting and Designing Liquid Cold Plates for Deployment in Electronic Systems
The use of liquid cooling systems is becoming more practical and effective for managing skyrocketing increases in power dissipation. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application? This webinar provides the best practices for implementing a liquid cooling system at the device level.
August 26, 2010 at 2:00 p.m. (EST)
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LED Thermal Management in Commercial and Consumer Lighting Applications
Why does thermal management matter? Excess heat directly affects both short-term and long-term LED performance. The short-term effects are color shift and reduced light output while the long-term effect is accelerated lumen depreciation and thus shortened useful life. Participants will learn how to diagnose and solve thermal issues in consumer and commercial LED applications.
September 23, 2010 at 2: 00 p.m. (EST)
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Thermal Management of Military Electronics
Electronics warfare systems, cyber-warfare, surveillance, guidance systems, UAV, Direct Energy Weapons and more are all part of our defense infrastructure. As in any electronics, thermal management is critical to these systems to insure long MTBF and proper operation through its life cycle. Attendees will understand the tradeoffs of cost vs. thermal management in order to choose a strategy best suited for their military electronics project.
October 14, 2010 at 2:00 p.m. (EST)
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Using Thermal Interface Materials to Improve Heat Sink Thermal Performance
To cool hotter components, engineers are turning to larger fans and heat sinks and added surface area. But these hardware changes add significant cost to the design. Alternatively, a cooling system’s performance can be improved just by using a better interface material to lower thermal resistance at the interface of the case and the heat sink. Participants will learn to overcome thermal challenges by making simple and cost-effective changes in thermal interface materials.
October 28, 2010 at 2:00 p.m. (EST)
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Basics and Options in Thermal Modeling and Analysis of Electronic Systems
Modeling and simulations are the cornerstone of any successful product launch of electronics products. Engineers are faced with three modeling options, Analytical, Computational and Experimental. In this tutorial, these modeling options are reviewed and their application to a problem domain is discussed.
November 18, 2010 at 2:00 p.m. (EST)
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Thermal Management of Telecomm Equipment
Telecommunications equipment has unique requirements for thermal management in order to meet the rigorous requirements of 5 - 9’s uptime, clear call quality and NEBS and ETSI certifications. In this webinar, thermal management of telecomm equipment is discussed along with commonly deployed cooling options. In addition, cooling options for higher power systems is presented. The presentation will conclude with a thermal design process to ensure that the NEBS and ETSI standard requirements are met.
December 9, 2010 at 2:00 pm (EST)
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Santa’s Sleigh: The Light Side of Thermal Management
Details coming soon!
December 16, 2010 at 2:00 pm (EST)
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