Nusil Technology has a new low outgassing, thermal interface silicone material available. It’s EPM-2495P offers some interesting specifications including Thermal Conductivity* 0.64 W/(mK).  It looks like it may take some work to use, requiring some mixing and curing and it requires a vacuum chamber to remove any air introduced during mixing. But, for low outgassing needs, Nusil’s EPM-2495P might be a good answer.
Of course, that begs the question, why? Why would you need to go to the trouble of a low outgassing thermal interface material? Because in some cases, outgassing 0f a material can interact with either the involved heat of the device being cooled or the chemicals in the material to which it’s outgassing too.  The result can be a breakdown in these material, reduced reliability and potentially reduced functionality.
And speaking of Thermal Interface Material, ATS’s thermal team wrote an informational article on Phase Change Interface Material that our readers might be interested in. Phase change material offers many of the benefits of grease with far less of the complications. Click to Phase Change Materials for Transient Electronics Cooling to have a read.
Of course, in extreme situations only grease will do. And were outgassing is a critical need, Nusil’s It’s EPM-2495P might be the best approach too.