Tag Archives: mechanical engineer

ATS’ Standard Board Level Heat Sinks for PCB

We’ve just released our new line of standard board level heat sinks. These stamped heat sinks are ideal for PCB application, especially where TO-220 packages are used. Available now through Digi-Key Electronics​ or at this link from ATS http://www.qats.com/eShop.aspx?produc…

 

To play MIT’s Space Invaders Remix, click here https://scratch.mit.edu/projects/1979…

ATS Heat Sink Hammer Test

Advanced Thermal Solutions brings the wacky and insane experiments of Crazy “Lenny”. Watch as he attempts to smash ATS’s patented maxiGRIP and superGRIP heat sink attachments with an assortment of hammers.

To learn more go to: www.qats.com/Heat-Sink/Attachments

 

The Monthly Qpedia is Out!

Qpedia_Aug13_coverThe monthly issue of Qpedia has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Application of TECs to Thermal Management of 3D ICs

From the thermal perspective, 3D stacked chips pose different challenges than what has been experienced in 2D packaging. For example, the heat dissipation of 3D ICs is highly non-uniform and multidirectional, due to the intrinsic chip architecture and the available real estate. When cooling at sub-ambient temperatures is necessary, the small footprint of a 3D chip becomes an impediment to deploying a cooling solution. Additionally, precision temperature control becomes difficult, since the surface to be controlled may be buried deep in the 3D stack. In response to cooling concerns about 3D ICs, this article presents a review of methods available for cooling 3D ICs to sub ambient temperatures using TECs.

Challenges in Testing Thermal Interface Materials

When choosing a thermal interface material (TIM), most of the time we look at the datasheet and find the thermal impedance if it is a solid material or the thermal conductivity if it is grease. Then, we calculate the thermal resistance and temperature rise with those numbers. But, how do we know that a TIM is performing as advertised? Can we really tell if one TIM will perform better than another, based on their specs? Additionally, the material presented in this article suggests that the data printed in TIM datasheets should be evaluated carefully to ensure that the testing procedures are similar to the actual application. Furthermore, even with the existing standards, many variables still exist.

Industry Developments: Portable Cooling Systems

Buildings and rooms constructed to house data centers are getting larger, more congested and warmer. Many of these structures have sophisticated thermal management systems featuring high-powered coolers or harnessing cold local water or air. For some needs, however, a portable cooling system can provide a much simpler and less costly solution. These systems can deliver direct cooling relief to equipment hot spots, and some can lower a room’s temperature when a central cooling system is inadequate or nonexistent.

Technology Review: Enhancing Heat Transfer on Surfaces

In this issue our spotlight is on enhancing heat transfer on surfaces. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now and see why over 18,000 engineer’s subscribe to Qpedia. Click here to subscribe Subscribe to ATS

Don’t forget the Qpedia Book Series Promotion that coolingZONE is currently running! Save 25% off the hardcover books that are a must have in every engineer’s library!

Qpedia, Official Media Sponsor of coolingZONE-13, Offers 30% Discount on Esteemed Book Series

Qpedia_banner4

Qpedia, the official media sponsor of coolingZONE-13, has just announced a special promotion offering a 30% discount on the widely read Qpedia Book Series. The promotion will take place at coolingZONE-13, the Thermal Management Industry International Summit in Boston, Massachusetts, October 21st -23rd, 2013. Additionally, the books will be available to purchase through coolingZONE’s online bookstore , with a 25% discount, until the conference ends on October 23. These books provide an expert resource for engineering professionals, students, educators and others who want to learn the latest theories and applications in the electronics cooling field.

The Qpedia Book series is a four volume set of highly technical articles, written and published by Advanced Thermal Solutions, Inc. The authors include Dr. Kaveh Azar, the company’s president and CEO; and Dr. Bahman Tavassoli, its chief technologist. Both Drs. Azar and Tavassoli are internationally recognized experts in the field of thermal management.

The four volume set contains over 250 in-depth articles filled with technical information, fundamental calculations and thoughtful analysis, printed in rich color in a hardbound book. They discuss the most critical areas of electronics cooling, covering a wide spectrum of topics in the telecom, aerospace and defense, embedded computing, medial, automotive, and semiconductor industries.

The articles, inspired by real-life scenarios, solve the thermal management challenges that today’s engineer is faced with. Drawn from personal experience, the veteran authors pass on knowledgeable examples of problem solving techniques that can be applied by all thermal and mechanical engineers. To order the complete book set, or individual volumes, please visit www.coolingzone.com/cart.

coolingZONE-13, the Thermal Management Industry International Summit, is a leading conference for all technical professionals in thermal management, electronics cooling, heat transfer and energy transport fields. The conference gathers recognized experts and technology companies in thermal management, providing solutions for the thermal engineering challenges of the future. Dr. Kaveh Azar, CEO of Advanced Thermal Solutions and Qpedia’s Editor-in-Chief, will be opening the conference with a keynote address on “The State of the Art in Thermal Management – From Vacuum Tubes to Super Computers”. Other keynote addresses include “Redefining Engineering as a Profession of Innovation” by Dr. Vincent Manno of Olin College and “Galinstan-Based Cooling of Microelectronics: Beyond Tuckerman and Pease?” by Dr. Marc Hodes of Tufts University. To learn more about coolingZONE-13, and to register for the conference, please visit: www.coolingzone.com

Next Webinar Shows How to Properly Measure and Analyze Temperatures in Electronic Systems

ATS WebinarsThe upcoming webinar “How to Perform and Understand Temperature Measurement in Electronic Systems” will be held this Thursday, September 12, 2013 at 2pm ET. The free, prerecorded technical presentation will deepen attendees understanding of the importance of temperature measurement in electronic systems. Attendees will learn about each of the instruments needed for measuring temperature and interpreting temperature data. Key locations will be identified where thermal testing should be conducted in order to obtain the most accurate and actionable results.

The webinar will be taught by Dr. Kaveh Azar, CEO of Advanced Thermal Solutions, Inc. Since 1985, Dr. Azar has been an active participant in the electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA. In addition, he has been the recipient of the IEEE SEMITHERM Significant Contributor Award in the thermal management of electronics systems.

Dr. Kaveh Azar

Dr. Kaveh Azar

Dr. Azar has been an invitee to national bodies such as NSF, NIST and NEMI for organizing government and industry research goals in electronics cooling. He has also been an adjunct professor at a number of universities, including Northeastern University, and lectures worldwide in analytical and experimental methods in electronics cooling.

He holds more than 36 national and international patents, and has published more than 75 articles, 3 book chapters and a book entitled Thermal Measurements in Electronics Cooling. Dr. Azar has also served as the editor in chief of Electronics Cooling Magazine, the premier resource for practitioners in the field of electronics thermal management, from the publications founding in 1995 to 2006.

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