ATS fanless, straight-fin heat sinks maximize system airflow for passive cooling of CPUs in a wide range of devices. These fanless, straight-fin heat sinks maximize system airflow to reliably cool high-performance processors at a lower cost than using heat sinks with fans. When attached with the available backing plate, these rugged heat sinks are usable on a wide variety of CPUs in industrial and commercial applications. Works with Intel, AMD, Nvidia CPUs, GPUs.
Available worldwide through our distribution network.
Edge computing devices are often installed environmentally severe and/or remote locations where reliable, long-term operation is essential. It is critical to thermally manage the CPUs, FPGAs, GPUs and other processing devices housed inside. Active cooling from ATS fanSINKs provides the cooling airflow continuously needed at the device level.
fanSINKs feature cross-cut, straight fins that maximize fan airflow for more efficient cooling. They are available for component packages from 27mm-84mm. Depending on their size, fanSINKs can be securely clipped onto a device with the ATS maxiGRIP attachment system, or with PEM screws or push pin hardware for direct attachment to the PCB. Smaller fanSINKs attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. Larger size fanSINKs fit tightly on components and attach firmly to the PCB with standoff and spring hardware.
fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. Fans for use with fanSINKs are customer specified and provided.
fanSINKS can be purchased via ATS’s global distribution network, including Mouser and Digi-Key and Sager. Also, Sager provides customer specific value add of fans to meet customer application requirements.
dualFLOW coolers are used in dense systems with high-powered processors, e.g., CPUs, FPGAs and GPUs. They feature a straight fin heat sink base with a high-performance blower that pulls air across the device from two directions for enhanced cooling. ATS dualFLOW coolers provide at least 20% improvement in thermal performance compared to other CPU coolers on the market.
They fit standard Intel™ LGA2011 square or LGA2066 sockets, also known as Socket R. A PCB backing-plate is available for applications other socket types.
dualFLOW models include aluminum or copper fins, and a vapor chamber base to match with needed thermal performance or weight restrictions.
Extruded metal heat sinks are among the lowest cost, widest used heat spreaders in electronics thermal management. Besides their affordability, extruded heat sinks are lightweight, readily cut to size and shape, and capable of high levels of cooling.
Most extruded heat sinks are made from
aluminum alloys, mainly from the 6000 alloy series, where aluminum dominates. Trace
amounts of other elements are added, including magnesium and silicon. These
alloys are easy to extrude and machine, are weldable, and can be hardened.
Common alloys for extruded heat sinks are the 6063 metals. These can be extruded as complex shapes, with very smooth surfaces. 6061 aluminum is also used for extrusions. Its tensile strength (up to 240 MPa) is superior to 6063 alloys (up to 186 MPa). In addition to heat sinks, these aluminum alloys are popular for architectural applications such as window and door frames. 
Aluminum alloys are popular for extruding as heat sinks because they provide both malleability and formability. They can be easily machined and are as little as one-third the density of steel. This results in extrusions that are both strong and stable, at a reduced cost relative to other materials.
The aluminum extrusion process starts
with designing and creating the die that will shape the heat sink profile. Once
this has been done, a cylindrical billet of aluminum is heated up in a forge to
high temperatures, generally between 800-925°F
(427-496°C). Next, a lubricant is added to the aluminum to prevent it from
sticking to any of the machinery. It is then placed on a loader and pressure is
applied with a ram to push heated aluminum through the die.
During this process, nitrogen is added in order to prevent oxidation. The extruded part will pass completely through the die and out the other side. It has now been elongated in the shape of the die opening. The finished extrusion is then cooled, and if necessary, a process of straightening and hardening creates the finished product.
They can be cut to the desired lengths, drilled and machined, and undergo a final aging process before being ready for market. 
Finished heat sinks typically come
with anodized surfaces, which can enhance their thermal performance.
Alternatively, a chromate finish provides some corrosion protection, or can be
used as a primer before a final paint or powder coating is applied. 
Extruded Heat Sinks
Extruded heat sink profiles range
from simple flat back fin structures to complex geometries for optimized
cooling. They can be used for natural (passive) or forced convection (active)
with an added fan or blower. Extruded profiles can also include special
geometries and groove patterns for use with clip or push pin attachment
Extrusions are also available in
bulk lengths, e.g. 8 feet, which can be cut to different lengths per customer
6063 aluminum alloy has a thermal conductivity of 201-218 W/(mK). Higher tensile strength 6061 aluminum’s thermal conductivity ranges from 151-202 W/(mK).
Besides choosing the aluminum alloy, selecting an optimal extruded
heat sink should factor in its overall dimensions and weight, the specified thermal
resistance, and the extrusion shape (flat-back, flat-back with gap, hollow,
double-sided, etc.). 
Extruded heat sinks can be designed with very thin, and thus more, fins than other sink types. They can be extruded with aspect ratios of around 8:1, which can greatly optimize heat sink performance. A heat sink’s aspect ratio is basically the comparison of its fin height to the distance between its fins.
In typical heat sinks the aspect ratio is between 3:1 and 5:1. A high aspect ratio heat sink has taller fins with a smaller distance between them for a ratio that can be 8:1 to 16:1 or greater.
a high aspect ratio heat sink provides greater density of fins in a given
footprint than with a more common size sink. The great benefit is the increased
amount of heat dissipating surface area it provides due to its additional fins.
Further, these heat sinks do not occupy any more length or width. The result is
a more efficient heat sink with higher performance per gram in the same
An extruded heat sink is used mainly to increase the surface area
available for heat transfer from high-power semiconductor devices, thus
reducing a given semiconductor’s external case temperature, as well as its
internal junction temperature.
This allows the semiconductor devices to perform at their highest
level, with maximum reliability. Such semiconductor devices include (but are
not limited to) RF power transistors, RF power amplifiers, Power MOSFETs,
IGBTs, inverter power modules, and thyristor modules.
In some power conversion circuit applications, large diodes, rectifiers, diode modules and even high-power resistors (thick film, etc.) can also require thermal contact with an extruded heat sink. For cooling DC-DC power converters and power modules, extruded heat sinks are available for full, half, quarter and one-eighth brick sizes