Category Archives: Heat Exchangers

Cooling AI Data Centers

How important are AI data centers? In just months, Elon Musk’s xAI team converted a factory outside Memphis into a cutting-edge, 100,000-GPU center for training the Colossus supercomputer—home to the Grok chatbot.

Initially powered by temporary gas turbines (later replaced by grid power), Colossus installed its first 100,000 chips in only 19 days, drawing praise from NVIDIA CEO Jensen Huang. Today, it operates 200,000 GPUs, with plans to reach 1 million GPUs by the end of 2025. [1]

Figure 1 – Elon Musk’s 1 Million Sq Ft xAI Colossus Supercomputer Facility near Memphis, TN. [1]

There are about 12,000 data centers throughout the world, nearly half of them in the United States. Now, more and more of these are being built or retrofitted for AI-specific workloads. Leaders include Musk’s xAI, Microsoft, Meta, Google, Amazon, OpenAI, and others.

High power is essential for such operations, and like computational electronics of all sizes heat issues need to be resolved.

GenAI

A key driver of data center growth is Generative AI (GenAI)—AI that creates text, images, audio, video, and code using deep learning. Chatbots and large language model ChatGPT are examples of GenAI, along with text-to-image models that generate images from written descriptions.

Managing all this is possible from new generations of processors, mainly GPUs. They all draw on higher levels of power and generate higher amounts of heat.

Figure 2 – Advanced AI Processor, the NVIDIA GH200 Grace Hopper Superchip with Integrated CPU to Increase Speed and Performance. [2,3]

AI data centers prioritize HPC hardware: GPUs, FPGAs, ASICs, and ultra-fast networking. Compared to CPUs (150–200 W), today’s AI GPUs often run >1,000 W.  . To handle massive datasets and complex computations in real-time they need significant power and cooling infrastructure.

Data Center Cooling Basics

Traditional HVAC was sufficient for older CPU-driven data centers. Today’s AI GPUs demand far more cooling, both at the chip level and facility-wide. This has propelled a need for more efficient thermal management systems at both the micro (server board and chip) and macro (server rack and facility) levels. [4]

Figure 3 – The Colossus AI Supercomputer Now Runs 200,000 GPUs. It Operates at 150MW Power, Equivalent to 80,000 Households. [5]

At Colossus, Supermicro 4U servers house NVIDIA Hopper GPUs cooled by:

  • Cold plates
  • Coolant distribution manifolds (1U between each server)
  • Coolant distribution units (CDUs) with redundant pumps at each rack base [6]

Each 4U server is equipped with eight NVIDIA H100 Tensor Core GPUs. Each rack contains eight 4U servers, totaling 64 GPUs per rack.

Between every server is a 1U manifold for liquid cooling. They connect with CDUs, heat-exchanging Coolant Distribution Units at the bottom of each rack that include a redundant pumping system. The choice of coolant is determined by a range of hardware and environmental factors.

Figure 4 – Each Colossus Rack Contains Eight 4U Servers, Totaling 64 GPUs Per Rack. Between Each Server is a 1U Manifold for Liquid Cooling. [7]
Figure 5 – The Base of Each Rack Has a 4U CDU Pumping System with Redundant Liquid Cooling. [7]

Role of Cooling Fans

Fans remain essential for DIMMs, power supplies, controllers, and NICs.

Figure 6 – Rear Door Liquid-Cooled Heat Exchangers. [7]

At Colossus, fans in the servers pull cooler air from the front of the rack, and exhaust the air at the rear of the server. From there, the air is pulled through rear door heat exchangers. The heat exchangers pass warm air through a liquid-cooled, finned heat exchanger/radiator, lowering its temperature before it exits the rack.

Direct-to-Chip Cooling

NVIDIA’s DGX H100 and H200 server systems feature eight GPUs and two CPUs that must run between 5°C and 30°C. An AI data center with a high rack density houses thousands of these systems performing HPC tasks at maximum load. Direct liquid cooling solutions are required.

Figure 7 – An NVIDIA DGX H100/H200 System Featuring Eight GPUs [8]
Figure 8 – The NVIDIA H100 SmartPlate Connects to a Liquid Cooling System to Bring Microconvective Chip-Level Cooling That Outperforms Air Cooling by 82%. [9]

Direct liquid cooling (cold plates contacting the GPU die) is the most effective method—outperforming air cooling by 82%. It is preferred for high-density deployments of the H100 or GH200.

Scalable Cooling Modules

Colossus represents the world’s largest liquid-cooled AI cluster, using NVIDIA + Supermicro technology. For smaller AI data centers, Cooling Distribution Modules (CDMs) provide a compact, self-contained solution.

Figure 9 – The iCDM-X Cooling Distribution Module from ATS Includes Pumps, Heat Exchanger and Liquid Coolant for Managing Heat from AI GPUs and Other Components. [10]

Most AI data centers are smaller, and power and cooling needs are lower, but essential. Many heat issues can be resolved using self-contained Cooling Distribution Modules.

The compact iCDM-X cooling distribution module provides up to 1.6MW of cooling for a wide range of AI GPUs and other chips. The module measures and logs all important liquid cooling parameters. It uses using just 3kW of power, and no external coolant is required.

These modules include:

•         Pumps

•         Heat exchangers

•         Cold plates

•         Digital monitoring (temp, pressure, flow)

Their sole external component is one or more cold plates removing heat from AI chips. ATS provides an industry-leading selection of custom and standard cold plates, including the high-performing ICEcrystal series.

Figure 10 – The ICEcrystal Cold Plates Series from ATS Provide 1.5 kW of Jet Impingement Liquid Cooling Directly onto AI Chip Hotspots.

Cooling Edge AI and Embedded Applications

AI isn’t just for big data centers—edge AI, robotics, and embedded systems (e.g., NVIDIA Jetson Orin, AMD Kria K26) use processors running under 100 W. These are effectively cooled with heat sinks and fan sinks from suppliers like Advanced Thermal Solutions. [11]

Figure 11 – High Performance Heat Sinks for NVIDIA and AMD AI Processors in Embedded and Edge Applications. [11]

NVIDIA also partners with Lenovo, whose 6th-gen Neptune cooling system enables full liquid cooling (fanless) across its ThinkSystem SC777 V4 servers—targeting enterprise deployments with NVIDIA Blackwell + GB200 GPUs. [12]

Figure 12 – Lenovo’s Neptune Direct Water Cooling Removes Heat from Power Supplies, for Completely Fanless Operation. [12]

Benefits gained from the Neptune system include:

  • Full system cooling (GPUs, CPUs, memory, I/O, storage, regulators)
  • Efficient for 10-trillion-parameter models
  • Improved performance, energy efficiency, and reliability

Conclusion

With surging demand, AI data centers are now a major construction focus. Historically, cooling problems are the #2 cause of data center downtime (behind power issues). With the high power needed for AI computing, these builds should carefully fit with their local communities in terms of electrical needs and sources, and water consumption. [13]

AI workloads will increase U.S. data center power demand by 165% by 2030 (Goldman Sachs), with nearly double 2022 levels (IBM/Newmark). Sustainable design and resource-conscious cooling are essential for the next wave of AI infrastructure. [14,15]

References

1. The Guardian, https://www.theguardian.com/technology/2025/apr/24/elon-musk-xai-memphis

2. Fibermall, https://www.fibermall.com/blog/gh200-nvidia.htm

3. NVIDA, https://resources.nvidia.com/en-us-grace-cpu/grace-hopper-superchip?ncid=no-ncid

4. ID Tech Ex, https://www.idtechex.com/en/research-report/thermal-management-for-data-centers-2025-2035-technologies-markets-and-opportunities/1036

5. Data Center Frontier, https://www.datacenterfrontier.com/machine-learning/article/55244139/the-colossus-ai-supercomputer-elon-musks-drive-toward-data-center-ai-technology-domination

6. Supermicro, https://learn-more.supermicro.com/data-center-stories/how-supermicro-built-the-xai-colossus-supercomputer

7. Serve The Home, https://www.servethehome.com/inside-100000-nvidia-gpu-xai-colossus-cluster-supermicro-helped-build-for-elon-musk/2/

8. Naddod, https://www.naddod.com/blog/introduction-to-nvidia-dgx-h100-h200-system

9. Flex, https://flex.com/resources/flex-and-jetcool-partner-to-develop-liquid-cooling-ready-servers-for-ai-and-high-density-workloads

10. Advanced Thermal Solutions, https://www.qats.com/Products/Liquid-Cooling/iCDM

11. Advanced Thermal Solutions, https://www.qats.com/Heat-Sinks/Device-Specific-Freescale

12. Lenovo, https://www.lenovo.com/us/en/servers-storage/neptune/?orgRef=https%253A%252F%252Fwww.google.com%252F

13. Deloitte, https://www2.deloitte.com/us/en/insights/industry/technology/technology-media-and-telecom-predictions/2025/genai-power-consumption-creates-need-for-more-sustainable-data-centers.html

14.GoldmanSachs, https://www.goldmansachs.com/insights/articles/ai-to-drive-165-increase-in-data-center-power-demand-by-2030

15. Newmark, https://www.nmrk.com/insights/market-report/2023-u-s-data-center-market-overview-market-clusters

Heat Exchangers Differ On Design To Enhance Thermal Management of Electronics

Heat exchangers are thermal management tools that are widely used across a variety of industries. Their basic function is to remove heat from designated locations by transferring it into a fluid. Inside the heat exchanger, the heat from this fluid passes to a second fluid without the fluids mixing or coming into direct contact. The original fluid, now cooled, returns to the assigned area to begin the heat transfer process again. 

There are a wide variety of heat exchangers for a variety of industries, in this article on the ATS Blog, we cover some of the different types and how they work: Industry Development: Heat Exchangers for Electronics Cooling.

3-D-printed Heat Exchangers provide flexibility in thermal management

By Norman Quesnel
Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc. (ATS)

Additive manufacturing technologies have expanded in many directions in recent years with applications ranging across numerous industries and applications, including into the thermal management of electronics. As metal 3-D printing techniques have improved and become commercially viable, engineers are using it to create innovative cooling solutions, particularly heat exchangers.

3-D Printed Heat Exchangers
Figure 1. 3-D developed heat exchangers can feature shapes not obtainable using traditional forming methods. [2]

Why are engineer turning to additive manufacturing?

One reason is that additive manufacturing allows for generous cost savings. Companies can reduce 15-20 existing part numbers and print them as a single component. A single part eliminates inventory, additional inspections, and assemblies that would have been necessary when components were produced individually.

As AdditiveManufacturing.com notes, “Some envision AM (additive manufacturing) as a complement to foundational subtractive manufacturing (removing material like drilling out material) and to a lesser degree forming (like forging). Regardless, AM may offer consumers and professionals alike, the accessibility to create, customize and/or repair product, and in the process, redefine current production technology.” [1]

Developed at the Massachusetts Institute of Technology (MIT), 3-D printing is the most common and well-known form of additive manufacturing. Three-dimensional objects are made by building up multiple layers of material. Thanks to the continued (and rapid) development of the technology and advanced research in materials science, the layers can be composed of metal, plastic, concrete, living tissue or other materials.

In industrial applications, 3-D printing has encouraged creativity. With additive manufacturing, designers can create complex geometric shapes that would not be possible with standard manufacturing processes. For example, shapes with a scooped out or hollow center can be produced as a single piece, without the need to weld or attach individual components together. One-piece shapes can provide extra strength, with few or no weak spots that can be compromised or stressed. [4]

Making 3-D Printed Heat Exchangers

Heat exchangers are integral to thermal management. Any time heat, cool air, or refrigeration are required, a heat exchanger has to be involved to dissipate the heat to the ambient. This can be as simple as a standard heat sink or a complex metal structure used in liquid cooling. It can be as small as a few millimeters or as large as a building. Heat exchange is a multi-billion-dollar industry touching everything from consumer goods to automotive and aerospace engineering.

Compact heat exchangers are typically composed of thin sheets of material that are welded together. The complexity of the designs, particularly the density of the fin field, makes production both challenging and time-consuming, while the material used for the welding process adds to the overall weight of the part. Heat exchangers produced through 3-D printing techniques (such as those pictured below) can be made quicker, lighter, and more efficiently.

Figure 2. 3-D developed heat exchanger had a 20% increase in efficiency. [2]

In 2016, a Department of Energy-funded consortium of researchers developed a miniaturized air-to-refrigerant heat exchanger that was more compact and energy-efficient than current market designs. CEEE and 3-D Systems teamed to increase the efficiency of a 1 kW heat exchanger by 20 percent while reducing weight and size. The manufacturing cycle for the heat exchanger was reduced from months to weeks. [4]

Figure 3. A 3-D printed milli-structured heat exchanger made from stainless steel with a gyroid design. [5]

Using direct metal printing (DMP), manufacturers delivered a 20-percent more efficient heat exchanger and an innovative design. It was produced in weeks not months and with significantly lower weight. The one-part, 3-D-printed heat exchanger required minimal secondary finishing operations.

Ohio-based Fabrisonic uses a hybrid metal 3-D printing process, called Ultrasonic Additive Manufacturing (UAM), to merge layers of metal foil together in a solid-state thanks to high frequency ultrasonic vibrations. [5]

Figure 4. Aluminum and copper heat exchanger printed using ultrasonic additive manufacturing. (Photo via Fabrisonic) [6]

Fabrisonic mounts its hybrid 3-D printing process on traditional CNC equipment – first, an object is built up with 3-D printing, and then smoothed down with CNC machining by milling to the required size and surface. No melting is required, as Fabrisonic’s 6 ft. x 6 ft. x 3 ft. UAM 3-D printer can scrub metal foil and build it up into the final net shape, and then machines down whatever else is needed at the end of the process.

This 3-D printing process was recently given a stamp of approval by NASA after testing at the Jet Propulsion Laboratory (JPL). A report from NASA and Fabrisonic said, “UAM heat exchanger technology developed under NASA JPL funding has been quickly extended to numerous commercial production applications. Channel widths range from 0.020 inch to greater than one inch with parts sized up to four feet in length.” [6]

There are challenges involved, to be sure. In an article from Alex Richardson of Aquicore highlighting research done at the University of Maryland, researchers discuss the problems that 3-D printing still has competing on price against traditional manufacturing techniques and the difficulties involved with physically scaling a technology up.

In the article, Vikrant Aute of the University of Maryland Center for Environmental Energy Engineering noted that his research team was “considering modularization to overcome the latter issue: Instead of making the exchangers bigger, it might be possible to arrange lots of them together to accomplish the same task.” [7]

Research Continues to Improve 3-D Printing Process

While there have been numerous advancements in the technology of metal 3-D printing, research is continuing on campuses and in companies around the world to try and improve the process and make it easier to create increasingly complex heat exchangers.

For example, Australia-based additive manufacturing startup Conflux Technology received significant funding to develop its technology specifically for heat exchange and fluid flow applications. [8] Another example was the University of Wisconsin-Madison, which received a grant from the U.S. Department of Energy (DOE) Advanced Research Projects Agency-Energy (ARPA-E) to build heat exchangers with “internal projections to increase turbulence and facilitate heat transfer. Such intricate shapes are impossible with traditional manufacturing.” [9]

In 2018, U.K.-based Hieta Technologies partnered with British metrology company Renishaw to commercialize its 3-D-printed heat exchangers. Renishaw used its AM250 system to 3-D print walls of the heat exchanger as thin as 150 microns. The samples were heat treated and characterized to confirm that the laser powder bed fusion process was effective. The process took only 80 hours, was 30 percent lighter, and had 30 percent less volume, while still meeting the heat transfer and pressure drop requirements. [10, 11]

Last month, GE Research announced that it was leading a multi-million-dollar program with Oak Ridge National Laboratory (ORNL) and the University of Maryland to develop compact heat exchangers that can withstand temperatures as high as 900°C and pressures as high as 250 bar. This was also based on funding from ARPA-E, as part of its HITEMMP (High-Intensity Thermal Exchanger through Materials and Manufacturing Processes) program. [12]

3-D Printed Heat Exchangers
Fig. 5. GE Research is leading a project to design a new, high-temperature heat exchanger with 3-D printing. [12]

To build the new heat exchanger, GE engineers are using a novel nickel superalloy that is designed for high temperatures and is crack-resistant. University of Maryland researchers are working with GE to create biological shapes that will make the heat exchanger more efficient and ORNL researchers are providing corrosion resistance expertise to develop the materials for long-term use.

These are just some examples of the many ways that 3-D printing has impacted electronics cooling. Researchers at the Fraunhofer Institute for Laser Technology ILT in Germany have demonstrated the feasibility of 3-D printing copper [13], U.K. researchers 3-D printed “smart materials” for energy storage [14], a researcher at Penn State (soon to be at MIT) is developing methods for creating rough surfaces through additive manufacturing to enhance boiling heat transfer [15], and at Virginia Tech researchers developed a new process for 3-D printing piezoelectric materials [16].

The technology is growing by leaps and bounds each year and is enhancing the options for engineers in the thermal management industry.

References

  1. http://additivemanufacturing.com/basics/
  2. https://www.3-Dsystems.com/learning-center/case-studies/direct-metal-printing-dmp-enables-ceee-manufacture-lean-and-green-heat
  3. https://www.spilasers.com/application-additive-manufacturing/additive-manufacturing-a-definition/
  4. https://www.3-Dsystems.com/learning-center/case-studies/direct-metal-printing-dmp-enables-ceee-manufacture-lean-and-green-heat
  5. http://fabrisonic.com/ultrasonic-additive-manufacturing-overview/
  6. https://aquicore.com/blog/3-D-printing-heat-exchangers/
  7. https://cdn2.hubspot.net/hubfs/3985996/Articles%20-%20published/NASA%20HX%20White%20Paper%20EWI.pdf
  8. https://www.confluxtechnology.com
  9. https://www.engr.wisc.edu/researchers-bring-3d-printing-cool-industry/
  10. https://3dprint.com/198933/hieta-renishaw-heat-exchangers/
  11. https://www.youtube.com/watch?v=r42Dc_PKBEc
  12. https://www.ge.com/research/newsroom/ge-researchers-utilize-3d-printing-design-ultra-performing-heat-exchanger-more-efficient
  13. https://www.ilt.fraunhofer.de/en/press/press-releases/press-release-2017/press-release-2017-08-30.html
  14. https://www.qmul.ac.uk/media/news/2018/se/scientists-design-material-that-can-store-energy-like-an-eagles-grip.html
  15. https://news.psu.edu/story/574464/2019/05/15/academics/heat-transfer-additive-manufacturing-powers-nsf-graduate-research
  16. https://vtnews.vt.edu/articles/2019/01/3d_printing_discovery.html

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com. To register for Qpedia and to get access to its archives, visit 
https://www.qats.com/Qpedia-Thermal-eMagazine.

Recent Research Into Next-Generation Heat Exchangers for Electronics Thermal Management

Since it was published around one year ago, the “What is a Heat Exchanger” video (watch it below) has been one of the most watched on the ATS YouTube page. With the obvious interest in heat exchangers in particular (and liquid cooling in general), we are curating recent research into the technology and its applications in the thermal management of electronics.

Heat Exchangers
Heat Exchangers are a common component in liquid cooling solutions for electronics. Below is recent research into this growing technology. (Advanced Thermal Solutions, Inc.)

The following are three examples of papers written about heat exchangers including applications in the automotive space to developing microchannels to enhance thermal performance to optimizing heat exchangers for use with high-powered electronics.

We have posted several pieces of content on this blog about heat exchangers in the past. Examples include:

Since heat exchangers remain a popular topic for engineers, we will continue to add new pieces about the technology in the coming months.

Novel Power Electronics Three-Dimensional Heat Exchanger

Read the full paper at https://www.nrel.gov/docs/fy14osti/61041.pdf.

Abstract: Electric-drive systems, which include electric machines and power electronics, are a key enabling technology to meet increasing automotive fuel economy standards, improve energy security, address environmental concerns, and support economic development. Enabling cost-effective electric-drive systems requires reductions in inverter power semiconductor area, which increases challenges associated with heat removal. In this paper, we demonstrate an integrated approach to the design of thermal management systems for power semiconductors that matches the passive thermal resistance of the packaging with the active convective cooling performance of the heat exchanger. The heat exchanger concept builds on existing semiconductor thermal management improvements described in literature and patents, which include improved bonded interface materials, direct cooling of the semiconductor packages, and double-sided cooling. The key difference in the described concept is the achievement of high heat transfer performance with less aggressive cooling techniques by optimizing the passive and active heat transfer paths. An extruded aluminum design was selected because of its lower tooling cost, higher performance, and scalability in comparison to cast aluminum. Results demonstrated a 102% heat flux improvement and a package heat density improvement over 30%, which achieved the thermal performance targets.

Microchannel Heat Exchanger for Electronics Cooling Applications

Read the full paper at http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=1636343.

Abstract: The power consumption of electronic devices, such as semiconductor diode laser bars, has continually increased in recent years while the heat transfer area for rejecting the associated thermal energy has decreased. As a result, the generated heat fluxes have become more intense making the thermal management of these systems more complicated. Air cooling methods are not adequate for many applications, while liquid cooled heat rejection methods can be sufficient. Significantly higher convection heat transfer coefficients and heat capacities associated with liquids, compared to gases, are largely accountable for higher heat rejection capabilities through the micro-scale systems. Forced convection in micro-scale systems, where heat transfer surface area to fluid volume ratio is much higher than similar macro-scale systems, is also a major contributor to the enhanced cooling capabilities of microchannels. There is a balance, however, in that more power is required by microchannels due to the large amount of pressure drop that are developed through such small channels. The objective of this study is to improve and enhance heat transfer through a microchannel heat exchanger using the computational fluid dynamics (CFD) method. A commercial software package was used to simulate fluid flow and heat transfer through the existing microchannels, as well as to improve its designs. Three alternate microchannel designs were explored, all with hydraulic diameters on the order of 300 microns. The resulting temperature profiles were analyzed for the three designs, and both the heat transfer and pressure drop performances were compared. The optimal microchannel cooler was found to have a thermal resistance of about 0.07 °C-cm2 /W and a pressure drop of less than half of a bar.

Thermal Analysis of the Heat Exchanger for Power Electronic Device with Higher Power Density

Read the full paper at http://pe.org.pl/articles/2012/12a/70.pdf. Abstract: Liquid cooling system has been used in high power electronic device systems to cool down the temperature of power electronic device. Heat exchanger is an important part of liquid cooling system to transfer the heat generated by power electronic device into air. In this paper, a Streamline-upwind/Petrov-Galerkin (SUPG) stabilized finite element analysis method was proposed to solve the water and air governing formulas including the mass conservation equation, the momentum conservation and the energy conservation equation. Furthermore, the thermal characteristic of a heat exchanger is simulated, and the result was compared with an experiment. The comparison shows that this method is effective.


For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com.

ATS Unveils Heat Exchanger Selection Tool

In 2017, Advanced Thermal Solutions, Inc. (ATS) added to its liquid cooling products with a new line of tube-to-fin, liquid-to-air heat exchangers with the industry’s highest density fins, which maximize heat transfer and provide greater cooling than other heat exchangers on the market.

Heat Exchanger Selection Tool

ATS released a line of tube-to-fin, liquid-to-air heat exchangers with the industry’s highest density fins to optimize heat transfer. (Advanced Thermal Solutions, Inc.)

ATS heat exchangers are available in seven different sizes and can be ordered with or without fans depending on your specific design requirements. Altogether, ATS offers 49 different heat exchanger options (not including the customized options to meet customer needs).

To make the selection process easier for engineers, ATS has recently unveiled a new Heat Exchanger Selection Tool that will point engineers to the exact option that will meet the inputted criteria.

Heat Exchanger Selection Tool

The tool asks five questions (measurement type in parentheses):

  • Air temperature from inlet to heat exchanger (Tai°C)
  • Heat need to be extracted by heat exchanger (QtotalW)
  • Water exit temperature from heat exchanger (Tfo°C)
  • Water flow rate (GPM)
  • Fan voltage (V)

Plug answers in to these questions and hit the “Optimum Heat Exchanger” button to see which of the ATS heat exchangers fits your specific liquid cooling system needs. Once you have the right part number, you can now purchase the right heat exchanger from Digi-Key Electronics.

In addition to heat exchangers, ATS has an array of liquid cooling products, including cold plates that provide 30 percent better thermal performance than comparable products on the market.

To learn more about the full line of liquid cooling options from ATS, visit https://www.qats.com/Products/Liquid-Cooling.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com.