When cooling IGBT modules and high-powered semiconductors, air cooling is often inadequate and liquid cooling is required. Cold plates are a way to implement localized cooling of power electronics by transferring heat from the device to a liquid that flows to a remote heat exchanger and dissipates into either the ambient or to another liquid in a secondary cooling system.

The internal, mini-channel fin structure enhances the surface area to maximize heat transfer with low pressure drop characteristics and provides uniform cold plate surface temperature.

To give engineers more freedom to apply Cold Plates to specific applications, ATS has taken the Standard Cold Plate family and created a DIY (“Do It Yourself”) family. The DIY Cold Plate family has the same thermal performance as the Standard Cold Plate family except that holes may be drilled in them to create a mounting pattern to match the specific connection points of the device being cooled. Each cold plate includes an etched “no drill zone” to provide a visual guide. After an engineer is satisfied with the mounting, ATS can manufacture their custom cold plates for prototypes or production.