Data Sheet Frequently Asked Questions ? Request a Quote More Links CWT Series Wind Tunnel Comparison Video: Open Loop Wind Tunnels Related Qpedia Articles Using Flow Visualization for PCB Thermal Design Versatile Labratory Wind Tunnels Why Use Research Quality Instruments? Basic Principles of Wind Tunnels Download Portal HP-97™ Component Simulators ATS’ HP-97™ Series are high-power component simulators used for replicating the heat dissipation conditions of devices. It features a 32 x 32 mm Aluminum block and a cartridge heater embedded within a high temperature DELRIN® housing and mounted to an FR4 plate. DELRIN® is known for its stiffness, dimensional stability, impact resistance, and structural strength. Typical applications for the HP-97™ Component Simulators include heat sink characterization and side-by-side heat sink comparison. Each Component Simulator has a temperature range of ambient to 110°C, ideal for most heat sink testing applications. Each unit is designed to fit within most Advanced Thermal Solutions, Inc. bench top, open loop and closed loop wind tunnels. Heat sinks are mounted to the component simulators via double-sided adhesive thermal tape. Custom attachment options are also available. A power source is required for operation. Thermal tape and power source are not included. Product Specifications Plate Dimensions (L x W): 33.7 x 29.2 cm (13.3 x 11.5") Simulator Dimensions (D x H): 6.4 x 1.9 cm (2.5 x 0.7") Heater Block Dimensions (L x W): 3.2 x 3.2 cm (1.3 x 1.3") Temperature Range: Up to 110ºC (185ºF) Power: 110V or 220V (International) Weight: 227 grams (8 oz) Materials: Aluminum, Delrin & FR4 Applications Component Simulation Heat Sink Comparison Heat Sink Characterization Wind Tunnel Testing Product and How To Videos The families of ATS thermal test instruments for the electronics industry. Instrument Product Family HP-97™ Power module for simulating heat-dissipating components ATVS-NxT™ Hot wire anemometer with touch screen PC & up to 32 channels for measuring temperature & velocity ATVS-2020™ Hot wire anemometer with up to 32 channels for measuring temperature & velocity eATVS-8™ Hot wire anemometer with 4 or 8 channels for measuring temperature & velocity HFC-100™ A system for controlling and measuring heat flux up to 1,000 w/cm2 ISD™ Analog hot wire anemometer board for measuring temperature and velocity tvLYT™ High-resolution liquid crystal thermography system for cost-effective temperature measurement PTM-1000™ A transducer for measuring static & differential pressure with 4 to 8 channels CIP-1000™ A controllable isothermal plate system for components & PCB testing TLC-100™ Thermochromic liquid crystal kit for heat mapping studies FCM-100™ Fan characterization module for generating PQ curve for a single fan or fan tray thermVIEW™ High-resolution thermography system with precise temperature accuracy iQ-200™ A single system for A single system for measuring temperature. velocity & pressure measuring temperature. velocity & pressure iFLOW-200™ An automatic system for cold plate characterization DAC-200™ Instrument for outputting analog voltage linearly proportional to air velocity and temperature. FSC-200™ Fan speed controller for automation of thermal testing Portable Anemometer Portable vane anemometer for measuring air flow speed & volumetric flow rate iQx-100™ A single system for measuring temperature velocity, pressure & humidity Closed Loop Wind Tunnels Thermally characterize components, boards and heat sinks undera range of air flows and temperature. Open Loop Wind Tunnels Thermally characterize components, boards and heat sinks undera range of air flows.
