GE Fanuc Intelligent Platforms Uses ATS Analysis and Design to Assure Thermal Reliability
When embedded computing manufacturer GE Fanuc Intelligent Platforms needed to identify the thermal characteristics of their new WANic™ 3860 Packet Processor and then develop a practical cooling system, they contacted Advanced Thermal Solutions (ATS) in Norwood, Mass. ATS, a global expert in electronics cooling, helps ensure component and system reliability in telecommunications, networking, embedded computing and other high performance markets. Based on analytical, computational and experimental data ATS testing generated, its engineers created a high performance, passive heat sink that employs the company’s patented maxiFLOW™ flared fin architecture. The new ATS-725 heat sink offered significant cost savings over an active heat sink that had been tested, and with more than 26 times the reliability. Download the full case study to learn more about this project.
Download the full case study