Natural airflow may not be sufficient for cooling BGAs and other hot components. This is often the case inside dense telecomm chassis, 1U and 2U servers, and blades. More cooling airflow is needed at the device level. Added airflow can be provided by
fanSINK™ heat sinks from Advanced Thermal Solutions, Inc. (ATS). Depending on their size,
fanSINK™ can be securely clipped onto a device with the ATS
maxiGRIP™ attachment system, or by using standoff and spring hardware for direct attachment to the PCB. Smaller
fanSINK™ attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. The fans for use with
fanSINK™ are not provided. Fan types are specific to customer requirements and should be sourced independently.