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Consulting

Thermal Management Consulting from Analysis to Validation

ATS offers thermal management consulting for high-performance electronics, spanning analytical, computational, and empirical methods across components, PCBs, shelves, chassis, and full system packaging.

Consulting Subscription

 

custom cooling solution

Custom Cooling Solutions

ATS delivers cost-effective cooling solutions with superior thermal performance using its 3-Core (3/C) design approach—combining analytical modeling, CFD simulation, and empirical testing. This process ensures optimized, validated designs from concept to prototype.

Working closely with clients, ATS evaluates air and liquid cooling options to meet thermal and system requirements, supporting everything from initial samples to high-volume global production.

Solutions extend beyond board-level cooling to full chassis design, integrating advanced technologies such as heat pipes, cold plates, vapor chambers, and complete liquid cooling systems.

Liquid Cooling System Design

ATS provides both off-the-shelf and custom liquid cooling solutions to meet demanding thermal requirements when air cooling is no longer sufficient. Using its 3-Core (3/C) design approach, ATS identifies the optimal cooling strategy early, reducing design time and cost.

Once liquid cooling is selected, ATS designs and integrates complete liquid loop systems, including all components and system packaging.

ATS specializes in custom cold plates, tailored in shape and material for various applications and fluids. For added flexibility, DIY cold plates allow engineers to modify mounting points while preserving internal performance.

liquid cooling solution
heat pipe and vapor chamber

Heat Pipe & Vapor Chamber Custom Designs

ATS designs advanced heat pipe and vapor chamber assemblies tailored to specific thermal applications, enabling efficient heat transfer in high-performance systems.

Vapor Chambers

ATS offers one of the industry's broadest ranges of vapor chambers—both off-the-shelf and custom—manufactured in the USA. Available in aluminum, copper, and titanium, sizes range from 25×25 mm to 250×250 mm, with customizable materials, wick structures, and working fluids to meet application needs.

Heat Pipe Assemblies

Heat pipes and vapor chambers enhance heat transport but require integration with heat sinks or system enclosures for effective dissipation. ATS engineers design complete thermal solutions incorporating these technologies to handle demanding thermal challenges.

From standard components to fully customized assemblies, ATS delivers scalable, high-performance thermal solutions.

Chassis Design & Systems Integration

ATS specializes in designing custom housings and chassis for a wide range of applications—from compact enclosures to high-performance ATCA and 1U/2U systems with advanced cooling capabilities up to 4.5KW.

By seamlessly integrating air and liquid cooling solutions, ATS empowers clients to bring products to market right the first time, delivering exceptional thermal performance with cost-efficient design.

Consulting Subscription
chassis design
testing and validation

Testing & Validation

ATS provides comprehensive in-house thermal testing to ensure real-world performance - from components to full systems. Its JEDEC-certified Thermal Characterization Lab supports extreme condition testing, including -40°C to 100°C environments and multi-bay system validation.

Through trusted partners, ATS also offers additional certification and compliance testing to support commercialization.

Lab Capabilities

ATS operates advanced Thermal Characterization Labs in Norwood, MA, equipped to analyze and test virtually any electronic system. With specialized instrumentation and multiple lab environments, ATS supports detailed thermal measurement, airflow analysis, and full system validation.

Capabilities include semiconductor and SSD characterization, airflow and pressure measurement, fan and liquid cooling analysis, thermography, and full liquid loop testing. Advanced tools such as wind tunnels, water flow visualization, and high-resolution thermography enable precise insight into thermal behavior and system performance.

PCB layout

PCB Layout & Thermal Design

ATS optimizes PCB layouts for thermal performance, improving reliability, reducing costs, and accelerating time to market across a wide range of applications. Services include CFD analysis at the CAD stage using tools such as 6SigmaET, FloTHERM, and CFDesign, along with wind tunnel testing of real or dummy boards. ATS also performs detailed thermal characterization using precision sensors, with testing conducted either in isolation or within full system environments.

By improving airflow and cooling at the component level, ATS often resolves thermal challenges through simple design adjustments rather than costly solutions.

QoolPCB – Fixed Cost PCB Cooling

QoolPCB is ATS's fixed-cost program for complete PCB cooling, covering design, engineering, hardware, testing, procurement, and delivery in a single price. Whether using off-the-shelf, custom, or hybrid heat sink solutions, the program eliminates separate costs for tooling, samples, verification, and supply chain management—reducing development time, cost, and risk.

ATS performs full thermal analysis, designs and supplies heat sinks and attachment hardware, and validates performance through in-house testing. All tooling and sample costs are included, and customers receive designs, reports, and access to ATS's lab for further verification.

Resource library

All application downloads in one place

ResourceIndustryTypeDownload
Vapor Chambers Heat Pipe & Vapor Chamber Custom Designs eBook Download PDF
Heat Pipes Heat Pipe & Vapor Chamber Custom Designs eBook Download PDF
Electric Vehicle Battery Thermal Management Automotive Applications Webinar View Webinar
How to Design a Liquid Loop Liquid Cooling System Design Webinar View Webinar
LED Thermal Management LED Applications Webinar View Webinar
Thermal Management of Telecom Equipment Telecom Applications Webinar View Webinar
Thermal Management of Defense Electronics Thermal Management Military Webinar View Webinar
The Effect of Compact PCB Layout PCB Board Layout Qpedia Articles Download PDF
Air Jet Impingement in a 1U System Chassis Design & Systems Integration Qpedia Articles Download PDF
Thermal Management of Defense Electronics Military & Defense Applications Qpedia Articles Download PDF
Heat Pipes Under Normal and Low Gravity Conditions Aerospace Applications Qpedia Articles Download PDF
Managing Heat in Next-Gen ATCA Chassis Chassis Design & Systems Integration Qpedia Articles Download PDF
Using Flow Visualization for PCB Thermal Design PCB Board Layout Qpedia Articles Download PDF
Strategies for CFD Modeling of Complex PCBs PCB Board Layout Qpedia Articles Download PDF
Multi-Chip Module Thermal Management Embedded Computing Qpedia Articles Download PDF
TECs & Micro TECs for Spot Cooling Electronics Embedded Computing Qpedia Articles Download PDF
Advanced MCs: Thermal Problems & Cooling Limits Embedded Computing Qpedia Articles Download PDF
Feasibility Study of an LED Based Lighting System LED Applications Qpedia Articles Download PDF
Heat Transfer Mechanisms in LED Packaging LED Applications Qpedia Articles Download PDF
Cooling High Power LEDs LED Applications Qpedia Articles Download PDF
Thermal Management Solutions for Medical Electronics Medical Applications Qpedia Articles Read Article
Air Jet Impingement in a 1U System Liquid Cooling System Design Qpedia Articles Download PDF
Customer Testimonials Custom Cooling Solutions Testimonials View Resource
Customer Testimonials Liquid Cooling Systems Design Testimonials View Resource
Customer Testimonials Chassis Design & Systems Integration Testimonials View Resource
Customer Testimonials QoolPCB Testimonials View Resource
Customer Testimonials PCB Board Layout Testimonials View Resource
Bio-Medical Device OEM Medical Applications Testimonials View Testimonial
Cavium Networks Telecom Applications Testimonials View Testimonial
Lemnis Lighting LED Applications Testimonials View Testimonial
Thermal Characterization Lab Brochure Testing & Validation Brochure Download PDF
Thermal Characterization Lab Brochure Lab Capabilities Brochure Download PDF
QoolPCB Brochure QoolPCB Brochure Download PDF
Understanding JEDEC Test Standards Testing & Validation Qpedia Articles Download PDF
NEBS Standards & Testing Criteria Testing & Validation Qpedia Articles Download PDF
Accurate Temperature Measurement Testing & Validation Qpedia Articles Download PDF
Next step

Need help solving a thermal design challenge?

Ready to discuss analysis, PCB layout, custom cooling, lab testing, or full system-level thermal design with ATS? Our engineers are here to help.

CFD Optimization of a Ruggedized Electro-Optical Cooling Architecture

ATS executed a baseline-to-optimized thermal design cycle for a ruggedized electro-optical module with mixed heat sources under elevated ambient conditions. The work focused on reducing thermal resistance and improving sensor temperature stability within tight packaging constraints.

Application: Portable threat detection / electro-optical module / embedded display systems Ambient: 40°C Total Heat Load: 27W Cooling Mode: Fan-forced convection
High-Performance Cold Plate
High-Performance Cold Plate

4 kW Multi-Cold-Plate Liquid Cooling System Design and Optimization

Advanced Thermal Solutions (ATS) designed and validated a 4 kW liquid cooling system using four 1000 W cold plates. Through analytical modeling and CFD validation, ATS optimized cold plate geometry and system flow to maximize thermal performance within manufacturing and hydraulic constraints.

Application: EV battery power conversion cooling / electro-optical module / embedded display systems Ambient: 45°C Total Heat Load: 4000 W Coolant: 50/50 water-glycol

Thermal Architecture Optimization of Dual Power Supply Modules

ATS optimized two power supply module architectures, Gen 4 and Gen 2, for operation at 45°C ambient. The work focused on clustered high-power devices, airflow utilization, and shared cooling strategies to maintain component compliance in a manufacturable package.

Application: Dual power supply modules Ambient: 45°C Architectures: Gen 4 and Gen 2 Focus: Airflow utilization and component compliance
High-Performance Cold Plate
High-Performance Cold Plate

Environmental Thermal Management of a Ruggedized Router Module

ATS engineered an environmental thermal solution for a ruggedized router module required to operate from -30°C to 55°C ambient. The design integrated both cooling and controlled heating to maintain reliable internal operating conditions across extreme environments

Application: Ruggedized router module Ambient Range: -30°C to 55°C Heat Load: 250 - 300 W Focus: Integrated cooling and heating

Analytical and CFD Optimization of a 1600 W Liquid-Cooled Rack Chassis

ATS used analytical calculations and CFD to optimize a liquid-cooled rack chassis integrating dual cold plates and an internal air-to-liquid heat exchanger. The work identified the governing bottleneck and guided architecture-level improvements for 1600 W heat rejection at 55°C ambient.

Application: Liquid-cooled rack chassis Ambient Range: 55°C Heat Load: 1600 W Cooling Elements: Dual cold plates + internal HEX
High-Performance Cold Plate