Banner for ATS Consulting Services
Design Services for Cooling Electronic Devices
Heat Sink Selection Tool Contact ATS
Related Qpedia Articles

Heat Pipe Assembly Design

Designing Heat Pipe and Vapor Chamber Assemblies

Thermal transport mechanisms such as heat pipes and vapor chambers are deployed to enhance heat transfer in certain applications, but neither technology will dissipate heat on its own. In line with ATS 3-Core Design Services, our engineers can design thermal solutions with embedded heat pipes or vapor chambers, using heat sinks, a chassis, or the system enclosure to remove the heat to the ambient. These innovative cooling solutions will meet even the toughest thermal challenges.

Heat pipes, as the video below explains, can be attached to assemblies with three common methods: epoxy, press-fit, and soldering. ATS engineers can design solutions using the method that best suits the desired applications and support the manufacture of high-quality prototypes right through to high-volume productions. ATS has expanded its line of off-the-shelf heat pipes to meet the demands of engineers. Choose from one of our wide selection of heat pipe options and let our engineers create a solution that meets your specific requirements.


Vapor Chamber

A vapor chamber (VC) is essentially a flat heat pipe that can be part of the base of a heat sink. It is vacuum-sealed and then injected with just enough liquid (e.g. water) to wet the wick. The theory of operation for a vapor chamber is the same as for a heat pipe. The heat source causes the liquid to vaporize on the evaporator side. The resulting pressure increase in this area forces the vapor into the condenser side, which is the base of the heat sink. Here, the vapor transfers the heat to the heat sink, and it then condenses back to liquid. The liquid is pumped back to the base through the capillary action of the wick structure. ATS has experience designing vapor chamber solutions for various applications and can design an assembly that will meet your thermal needs.