maxiFLOW Slant Fin HS
DC-DC Converter HS
Zipper Fin
CPU Coolers Passive
Device Specific Heat Sinks
Stamped Heat Sinks
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Cross Cut Heat Sinks
ASIC Heat Sinks
High Capacity Air Cooling™
CPU Coolers Active
fanSINKS™
Extrusions Profile
Slant Fin Extrusion Profile
Pin Fin Extrusion Profile
Straight Fin Extrusion Profile
LED Star HS Extrusion
pcbCLIP™
HS Attachments
Push Pin Heat Sinks
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HP Bending Tools
Liquid Cooled Heat Sink
High-Performance Cold Plates
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Flow Meter
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Leak Detector
iCDM
Vapor Chambers
Custom Vapor Chamber
Overview
Multi Sensor PBL
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Spot Sensor
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Micro Sensor
Multi-Sensor in Plane
Hand-Held Surface Probe
Hand-Held Probe
ATVS-NxT™
ATVS-2030™
ATVS-2020™
eATVS-2030™
eATVS-8™
eATVS-4™
iQx-100™
iQ-200™
PTB-1000™
PTM-1000™
ethermVIEW™
thermVIEW™
tvLYT™
TLC-100™
CIP-1000™
DAC-200™
FCM-100™
FSC-200™
HFC-100™
iFLOW-200™
iTHERM-100™
iTHERM-200™
Dual-Cascade Cooling System
Double Cooling System (LED)
Double Cooling System (USB)
Portable Ultra-Low Temperature Freezer
Self-Cascade Refrigeration Systems
TEC Assembly
TEC Modules
CLWT-067™
CLWT-067-PCIe™
CLWT-100™
CLWT-150™
CLWT-200™
CLWT-115™
BWT-100™
BWT-104™
CWT-100™
CWT-106™
CWT-107™
CWT-108™
CWT-PCB™
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Internet of Things
LED Applications
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Thermal Management Military
Thermal Management PCIe
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Heat Pipe & Vapor Chamber Design
Liquid Cooling System Design
Heat Pipe &Vapor Chamber Design
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Customer Notice regarding AD-CVD investigation on aluminum extrusions and how ATS is helping its customers.
High Capacity Air Cooling
Extrusions Profiles
LED STAR HS Extrusion
ATS Chillers
ATS Refrigeration
CLWTC-1000™
HP-97™
WTC-100™
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QoolPCB
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With its custom 3D printer, ATS offers 3D printing for the testing and validation of mockup PCB boards. Early board designs and re-spins are often limited in quantity until the final design is approved and manufactured. 3D printed circuit boards allow the airflow and temperature testing and validation services to be performed on the prototype PCB. This allows ATS to start validating the board and its heat sinks without waiting for the final actual PCB to be shipped, saving valuable design time and avoiding expensive PCB spins.
Additionally, if this engagement is done at the conceptual stage, the prototype board can be tested in ATS’ water tunnel for optimum thermal layout. Where, such a layout is communicated to the design engineer for electrical feasibility. This process has saved many designs to avoid heat sink or other cooling solutions since the board’s layout has optimal system airflow for cooling of the components on the PCB. After the CAD files are provided by the customer, ATS is able to print an exact or scaled replica of the PCB for thermal evaluation and PCB layout optimization.