Device Specific

Group by:	Sort by:	Results per page:
	Products: All \| eShop \| By Distributor \| By Quote

Title or Part#

Advanced Search

Dimensions

L (mm)
W (mm)
H (mm)

Thermal Resistance (Â°C/W)

Unducted
Ducted

Component Specific

HS Type

HS By Attachment

Designed for the ADI reference designs AD9166,AD9986/8, AD9081/2, and the quad-mxFE
Component Attachment: ATS superGRIP™ is a proven high reliability mechanical attachment system
Provided with pre-assembled Thermal Interface Material (TIM) centered on based

Designed and purpose built to fit the NVIDIA Jetson Family of modules
Passive and active solutions available
Straight-fin, black anodized, aluminum heat sinks
A fan attachment hardware kit is provided for heat sinks that will use fans. The fans are not included and should be chosen to match performance needs.

Designed for flip-chip processors such as NXP MPCs
maxiGRIP™attachment applies steady, even pressure to the component and does not require holes in the PCB
Comes preassembled with high performance, phase changing, thermal interface material