maxiFLOW™ heat sinks feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling and
superGRIP™ offers the least amount of keep-out area required around a given BGA.
maxiFLOW™ heat sink with the
superGRIP™ attachment system are the ideal cooling solution for high-density PCBs, where the thermal requirements and board routing makes the use of other heat sink attachments difficult or impossible.